參數(shù)資料
型號: MPC8313EVRAGDB
廠商: Freescale Semiconductor
文件頁數(shù): 61/99頁
文件大小: 0K
描述: MPU POWERQUICC II PRO 516-PBGA
標準包裝: 40
系列: MPC83xx
處理器類型: 32-位 MPC83xx PowerQUICC II Pro
速度: 400MHz
電壓: 0.95 V ~ 1.05 V
安裝類型: 表面貼裝
封裝/外殼: 516-BBGA 裸露焊盤
供應(yīng)商設(shè)備封裝: 516-PBGAPGE(27x27)
包裝: 托盤
MPC8313E PowerQUICC II Pro Processor Hardware Specifications, Rev. 4
64
Freescale Semiconductor
19.2
Mechanical Dimensions of the MPC8313E TEPBGAII
This figure shows the mechanical dimensions and bottom surface nomenclature of the 516-TEPBGAII
package.
Figure 56. Mechanical Dimension and Bottom Surface Nomenclature of the MPC8313E TEPBGAII
Notes:
1. All dimensions are in millimeters.
2. Dimensions and tolerances per ASME Y14.5M-1994.
3. Maximum solder ball diameter measured parallel to datum A.
4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
5. Package code 5368 is to account for PGE and the built-in heat spreader.
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