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| 型號(hào)： | MPC8313ECVRADDB |
| 廠(chǎng)商： | Freescale Semiconductor |
| 文件頁(yè)數(shù)： | 82/99頁(yè) |
| 文件大小： | 0K |
| 描述： | MPU POWERQUICC II PRO 516-PBGA |
| 標(biāo)準(zhǔn)包裝： | 40 |
| 系列： | MPC83xx |
| 處理器類(lèi)型： | 32-位 MPC83xx PowerQUICC II Pro |
| 速度： | 267MHz |
| 電壓： | 0.95 V ~ 1.05 V |
| 安裝類(lèi)型： | 表面貼裝 |
| 封裝/外殼： | 516-BBGA 裸露焊盤(pán) |
| 供應(yīng)商設(shè)備封裝： | 516-PBGAPGE（27x27） |
| 包裝： | 托盤(pán) |
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MPC8313E PowerQUICC II Pro Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
83
21.2
Thermal Management Information
For the following sections, PD = (VDD IDD) + PI/O, where PI/O is the power dissipation of the I/O drivers.
21.2.1
Estimation of Junction Temperature with Junction-to-Ambient
Thermal Resistance
An estimation of the chip junction temperature, TJ, can be obtained from the equation:
TJ = TA + (RJA PD)
where:
TJ = junction temperature (C)
TA = ambient temperature for the package (C)
RJA = junction-to-ambient thermal resistance (C/W)
PD = power dissipation in the package (W)
The junction-to-ambient thermal resistance is an industry standard value that provides a quick and easy
estimation of thermal performance. As a general statement, the value obtained on a single layer board is
appropriate for a tightly packed printed-circuit board. The value obtained on the board with the internal
planes is usually appropriate if the board has low power dissipation and the components are well separated.
Test cases have demonstrated that errors of a factor of two (in the quantity TJ – TA) are possible.
21.2.2
Estimation of Junction Temperature with Junction-to-Board
Thermal Resistance
The thermal performance of a device cannot be adequately predicted from the junction-to-ambient thermal
resistance. The thermal performance of any component is strongly dependent on the power dissipation of
surrounding components. In addition, the ambient temperature varies widely within the application. For
many natural convection and especially closed box applications, the board temperature at the perimeter
Junction-to-case
—
RJC
8°C/W
5
Junction-to-package top
Natural convection
JT
7°C/W
6
Note:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal resistance.
2. Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
Table 69. Package Thermal Characteristics for TEPBGAII (continued)
Characteristic
Board Type
Symbol
TEPBGA II
Unit
Note
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相關(guān)代理商/技術(shù)參數(shù) |
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|---|---|
| MPC8313ECVRADDC | 功能描述:微處理器 - MPU 8313 REV2.2 W/ENC EXT RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8313ECVRAFD | 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8313ECVRAFDA | 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8313ECVRAFDB | 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8313ECVRAFF | 功能描述:微處理器 - MPU 8313 NOPB PBGA W/ ENCR RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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