This table provides the curr" />
參數(shù)資料
型號(hào): MPC8308VMAGD
廠(chǎng)商: Freescale Semiconductor
文件頁(yè)數(shù): 3/83頁(yè)
文件大?。?/td> 0K
描述: MPU POWERQUICC II PRO 473MAPBGA
產(chǎn)品培訓(xùn)模塊: MPC8308 PowerQUICC II Pro Processor
特色產(chǎn)品: MPC8308 PowerQUICC? II Pro Processor
標(biāo)準(zhǔn)包裝: 84
系列: MPC83xx
處理器類(lèi)型: 32-位 MPC83xx PowerQUICC II Pro
速度: 400MHz
電壓: 1V
安裝類(lèi)型: 表面貼裝
封裝/外殼: 473-LFBGA
供應(yīng)商設(shè)備封裝: 473-MAPBGA(19x19)
包裝: 托盤(pán)
MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3
Freescale Semiconductor
11
DDR2 SDRAM
This table provides the current draw characteristics for MVREF.
6.2
DDR2 SDRAM AC Electrical Characteristics
This section provides the AC electrical characteristics for the DDR2 SDRAM interface.
6.2.1
DDR2 SDRAM Input AC Timing Specifications
This table provides input AC timing specifications for the DDR2 SDRAM when GVDD(typ)=1.8 V.
This table provides input AC timing specifications for the DDR2 SDRAM interface.
Table 15. Current Draw Characteristics for MVREF
Parameter / Condition
Symbol
Min
Max
Unit
Note
Current draw for MVREF
IMVREF
500
A1
Note:
1. The voltage regulator for MVREF must be able to supply up to 500 A current.
Table 16. DDR2 SDRAM Input AC Timing Specifications for 1.8 V Interface
At recommended operating conditions with GVDD of 1.8 ± 100 mV
Parameter
Symbol
Min
Max
Unit
Notes
AC input low voltage
VIL
—MVREF – 0.45
V
AC input high voltage
VIH
MVREF + 0.45
V
Table 17. DDR2 SDRAM Input AC Timing Specifications
At recommended operating conditions. with GVDD of 1.8± 100 mV
Parameter
Symbol
Min
Max
Unit
Notes
Controller skew for MDQS—MDQ/MECC
266 MHz
tCISKEW
–875
875
ps
1, 2,3
Notes:
1. tCISKEW represents the total amount of skew consumed by the controller between MDQS[n] and any corresponding bit that is
captured with MDQS[n]. This should be subtracted from the total timing budget.
2. The amount of skew that can be tolerated from MDQS to a corresponding MDQ or MECC signal is called tDISKEW. This can
be determined by the following equation: tDISKEW = +/–(T/4 – abs(tCISKEW)) where T is the clock period and abs(tCISKEW) is
the absolute value of tCISKEW.
3. Memory controller ODT value of 150
is recommended
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MPC8308VMAGDA 功能描述:微處理器 - MPU E300 MP PbFr 400 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8308ZQADD 功能描述:微處理器 - MPU E300 MP Pb 266 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8308ZQADDA 功能描述:微處理器 - MPU E300 MP Pb 266 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8308ZQAFD 功能描述:微處理器 - MPU E300 MP Pb 333 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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