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| 型號(hào)： | MPC8308VMAFD |
| 廠(chǎng)商： | Freescale Semiconductor |
| 文件頁(yè)數(shù)： | 74/83頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | MPU POWERQUICC II PRO 473MAPBGA |
| 產(chǎn)品培訓(xùn)模塊： | MPC8308 PowerQUICC II Pro Processor |
| 特色產(chǎn)品： | MPC8308 PowerQUICC? II Pro Processor |
| 標(biāo)準(zhǔn)包裝： | 84 |
| 系列： | MPC83xx |
| 處理器類(lèi)型： | 32-位 MPC83xx PowerQUICC II Pro |
| 速度： | 333MHz |
| 電壓： | 1V |
| 安裝類(lèi)型： | 表面貼裝 |
| 封裝/外殼： | 473-LFBGA |
| 供應(yīng)商設(shè)備封裝： | 473-MAPBGA（19x19） |
| 包裝： | 托盤(pán) |
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MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3
76
Freescale Semiconductor
Thermal
appropriate for a tightly packed printed-circuit board. The value obtained on the board with the internal
planes is usually appropriate if the board has low power dissipation and the components are well separated.
Test cases have demonstrated that errors of a factor of two (in the quantity TJ – TA) are possible.
22.2.2
Estimation of Junction Temperature with Junction-to-Board
Thermal Resistance
The thermal performance of a device cannot be adequately predicted from the junction-to-ambient thermal
resistance. The thermal performance of any component is strongly dependent on the power dissipation of
surrounding components. In addition, the ambient temperature varies widely within the application. For
many natural convection and especially closed box applications, the board temperature at the perimeter
(edge) of the package is approximately the same as the local air temperature near the device. Specifying
the local ambient conditions explicitly as the board temperature provides a more precise description of the
local ambient conditions that determine the temperature of the device.
At a known board temperature, the junction temperature is estimated using the following equation:
TJ = TB + (RJB PD)
where:
TJ = junction temperature (C)
TB = board temperature at the package perimeter (C)
RJB = junction-to-board thermal resistance (C/W) per JESD51–8
PD = power dissipation in the package (W)
When the heat loss from the package case to the air can be ignored, acceptable predictions of junction
temperature can be made. The application board should be similar to the thermal test condition: the
component is soldered to a board with internal planes.
22.2.3
Experimental Determination of Junction Temperature
To determine the junction temperature of the device in the application after prototypes are available, the
thermal characterization parameter (
JT) can be used to determine the junction temperature with a
measurement of the temperature at the top center of the package case using the following equation:
TJ = TT + (JT PD)
where:
TJ = junction temperature (C)
TT = thermocouple temperature on top of package (C)
JT = thermal characterization parameter (C/W)
PD = power dissipation in the package (W)
The thermal characterization parameter is measured per JESD51-2 specification using a 40 gauge type T
thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so
that the thermocouple junction rests on the package. A small amount of epoxy is placed over the
thermocouple junction and over about 1 mm of wire extending from the junction. The thermocouple wire
is placed flat against the package case to avoid measurement errors caused by cooling effects of the
thermocouple wire.
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