參數(shù)資料
型號： MPC8308CVMADD
廠商： Freescale Semiconductor
文件頁數(shù)： 79/83頁
文件大小： 0K
描述： MPU POWERQUICC II PRO 473MAPBGA
產(chǎn)品培訓模塊： MPC8308 PowerQUICC II Pro Processor
特色產(chǎn)品： MPC8308 PowerQUICC? II Pro Processor
標準包裝： 84
系列： MPC83xx
處理器類型： 32-位 MPC83xx PowerQUICC II Pro
速度： 266MHz
電壓： 1V
安裝類型： 表面貼裝
封裝/外殼： 473-LFBGA
供應商設備封裝： 473-MAPBGA（19x19）
包裝： 托盤
MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3
80
Freescale Semiconductor
Ordering Information
23.7
Pull-Up Resistor Requirements
The device requires high resistance pull-up resistors (10 k
is recommended) on open drain type pins
including I2C, Ethernet management MDIO, HRESET and IPIC (integrated programmable interrupt
controller).
Correct operation of the JTAG interface requires configuration of a group of system control pins as
demonstrated in Figure 56. Care must be taken to ensure that these pins are maintained at a valid deasserted
state under normal operating conditions because most have asynchronous behavior and spurious assertion,
which give unpredictable results.
24 Ordering Information
This section presents ordering information for the devices discussed in this document, and it shows an
example of how the parts are marked. Ordering information for the devices fully covered by this document
24.1
Part Numbers Fully Addressed by This Document
This table provides the Freescale part numbering nomenclature for the MPC8308 family. Note that the
individual part numbers correspond to a maximum processor core frequency. For available frequencies,
contact your local Freescale sales office. In addition to the maximum processor core frequency, the part
numbering scheme also includes the maximum effective DDR memory speed. Each part number also
contains a revision code which refers to the die mask revision number.
Table 61. Part Numbering Nomenclature
MPC
nnnn
C
VM
AD
D
A
Product
Code
Part
Identifier
Temperature
Range1,4
Package2
e300 Core
Frequency3
DDR
Frequency
Revision
Level
MPC
8308
Blank = 0 to
105
C
C = –40 to 105
C
VM = Pb-free 473
MAPBGA
AD = 266 MHz
AF = 333 MHz
AG = 400 MHz
D = 266 MHz
Contact local
Freescale
sales office
Notes:
1. Contact local Freescale office on availability of parts with C temperature range.
2. See Section 20, “Package and Pin Listings,” for more information on available package types.
3. Processor core frequencies supported by parts addressed by this specification only. Not all parts described in this
specification support all core frequencies. Additionally, parts addressed by Part Number Specifications may support
other maximum core frequencies
4. Minimum temperature is specified with TA; Maximum temperature is specified with TJ
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相關代理商/技術參數(shù)
參數(shù)描述
MPC8308CVMADDA 功能描述:微處理器 - MPU E300 ext tmp Qual 266 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8308CVMAFD 功能描述:微處理器 - MPU E300 ext tmp Qual 333 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8308CVMAFDA 功能描述:微處理器 - MPU E300 ext tmp Qual 333 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8308CVMAGD 功能描述:微處理器 - MPU E300 EXT TMP 400 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8308CVMAGDA 功能描述:微處理器 - MPU E300 EXT TMP 400 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
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