參數(shù)資料
型號(hào)： MPC8306SVMADDCA
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 266 MHz, RISC PROCESSOR, PBGA369
封裝： 19 X 19 MM, 1.61 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, MAPBGA-369
文件頁(yè)數(shù)： 62/71頁(yè)
文件大?。?/td> 452K
代理商： MPC8306SVMADDCA
MPC8306S PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 0
Freescale Semiconductor
65
System Design Information
21.2
Heat Sink Attachment
When attaching heat sinks to these devices, an interface material is required. The best method is to use
thermal grease and a spring clip. The spring clip should connect to the printed-circuit board, either to the
board itself, to hooks soldered to the board, or to a plastic stiffener. Avoid attachment forces which would
lift the edge of the package or peel the package from the board. Such peeling forces reduce the solder joint
lifetime of the package. Recommended maximum force on the top of the package is 10 lb (4.5 kg) force.
If an adhesive attachment is planned, the adhesive should be intended for attachment to painted or plastic
surfaces and its performance verified under the application requirements.
21.2.1
Experimental Determination of the Junction Temperature with a
Heat Sink
When heat sink is used, the junction temperature is determined from a thermocouple inserted at the
interface between the case of the package and the interface material. A clearance slot or hole is normally
required in the heat sink. Minimizing the size of the clearance is important to minimize the change in
thermal performance caused by removing part of the thermal interface to the heat sink. Because of the
experimental difficulties with this technique, many engineers measure the heat sink temperature and then
back calculate the case temperature using a separate measurement of the thermal resistance of the
interface.
From this case temperature, the junction temperature is determined from the junction-to-case thermal
resistance using the following equation:
TJ = TC +(RJC PD)
Eqn. 5
where:
TC = case temperature of the package (C)
RJC = junction-to-case thermal resistance (C/W)
PD = power dissipation (W)
22 System Design Information
This section provides electrical and thermal design recommendations for successful application of the
MPC8306S.
22.1
System Clocking
The MPC8306S includes three PLLs.
The system PLL (AVDD2) generates the system clock from the externally supplied SYS_CLK_IN
input. The frequency ratio between the system and SYS_CLK_IN is selected using the system PLL
ratio configuration bits as described in Section 20.2, “System PLL Configuration.”
The e300 core PLL (AVDD3) generates the core clock as a slave to the system clock. The frequency
ratio between the e300 core clock and the system clock is selected using the e300 PLL ratio
configuration bits as described in Section 20.3, “Core PLL Configuration.”
相關(guān)PDF資料
PDF描述
MPC8306SCVMADDCA 32-BIT, 266 MHz, RISC PROCESSOR, PBGA369
MPC8306VMACDCA 32-BIT, 200 MHz, RISC PROCESSOR, PBGA369
MPC8306CVMACDCA 32-BIT, 200 MHz, RISC PROCESSOR, PBGA369
MPC8306VMABDCA 32-BIT, 133 MHz, RISC PROCESSOR, PBGA369
MPC8306CVMADDCA 32-BIT, 266 MHz, RISC PROCESSOR, PBGA369
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8306SVMADDCA 制造商:Freescale Semiconductor 功能描述:IC 32-BIT MPU 266 MHz 369-LFBGA
MPC8306SVMAFDCA 功能描述:微處理器 - MPU E300 MP 333 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8306VMABDC 制造商:Freescale Semiconductor 功能描述:MPC8306VMABDC - Bulk
MPC8306VMABDCA 功能描述:微處理器 - MPU E300 MP 133 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8306VMACDC 制造商:Freescale Semiconductor 功能描述:MPC8306VMACDC - Bulk
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