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參數(shù)資料
| 型號(hào)： | MPC8280ZQIX |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 200 MHz, RISC PROCESSOR, PBGA516 |
| 封裝： | 27 X 27 MM, 2.25 MM, 1 MM PITCH, PLASTIC, BGA-516 |
| 文件頁(yè)數(shù)： | 75/83頁(yè) |
| 文件大?。?/td> | 618K |
| 代理商： | MPC8280ZQIX |
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MPC8280 PowerQUICC II Family Hardware Specifications, Rev. 2
Freescale Semiconductor
77
Package Description
9.2
Mechanical Dimensions
This figure provides the mechanical dimensions and bottom surface nomenclature of the 480 TBGA
(ZU/VV) package. See Table 2, “HiP7 PowerQUICC II Device Packages.”
Figure 17. Mechanical Dimensions and Bottom Surface Nomenclature—480 TBGA
Dim
Millimeters
Min
Max
A
1.45
1.65
A1
0.60
0.70
A2
0.85
0.95
A3
0.25
—
b
0.65
0.85
D
37.50 BSC
D1
35.56 REF
e
1.27 BSC
E
37.50 BSC
E1
35.56 REF
Notes:
1. Dimensions and Tolerancing per ASME Y14.5M-1994.
2. Dimensions in millimeters.
3. Dimension b is measured at the maximum solder ball diameter, parallel to primary data A.
4. Primary data A and the seating plane are defined by the spherical crowns of the solder balls.
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