1. 參數(shù)資料
    型號: MPC8272CZQM
    廠商: Motorola, Inc.
    英文描述: MPC8272 PowerQUICC II Family Hardware Specifications
    中文描述: MPC8272的PowerQUICC II系列硬件規(guī)格
    文件頁數(shù): 12/56頁
    文件大?。?/td> 539K
    代理商: MPC8272CZQM
    12
    MPC8272 PowerQUICC II Family Hardware Specifications
    PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
    For More Information On This Product,
    Go to: www.freescale.com
    MOTOROLA
    Thermal Characteristics
    4.2
    Estimation with Junction-to-Case Thermal Resistance
    Historically, the thermal resistance has frequently been expressed as the sum of a junction-to-case thermal
    resistance and a case-to-ambient thermal resistance:
    R
    θ
    JA
    = R
    θ
    JC
    + R
    θ
    CA
    where:
    R
    θ
    JA
    = junction-to-ambient thermal resistance (oC/W)
    R
    θ
    JC
    = junction-to-case thermal resistance (oC/W)
    R
    θ
    CA
    = case-to-ambient thermal resistance (oC/W)
    R
    θ
    JC
    is device related and cannot be influenced by the user. The user adjusts the thermal environment to
    affect the case-to-ambient thermal resistance, R
    θ
    CA
    . For instance, the user can change the air flow around
    the device, add a heat sink, change the mounting arrangement on the printed circuit board, or change the
    thermal dissipation on the printed circuit board surrounding the device. This thermal model is most useful
    for ceramic packages with heat sinks where some 90% of the heat flows through the case and the heat sink
    to the ambient environment. For most packages, a better model is required.
    4.3
    Estimation with Junction-to-Board Thermal Resistance
    A simple package thermal model which has demonstrated reasonable accuracy (about 20%) is a two-resistor
    model consisting of a junction-to-board and a junction-to-case thermal resistance. The junction-to-case
    thermal resistance covers the situation where a heat sink is used or where a substantial amount of heat is
    dissipated from the top of the package. The junction-to-board thermal resistance describes the thermal
    performance when most of the heat is conducted to the printed circuit board. It has been observed that the
    thermal performance of most plastic packages, especially PBGA packages, is strongly dependent on the
    board temperature.
    If the board temperature is known, an estimate of the junction temperature in the environment can be made
    using the following equation:
    T
    J
    = T
    B
    + (R
    θ
    JB
    ×
    P
    D
    )
    where:
    R
    θ
    JB
    = junction-to-board thermal resistance (oC/W)
    T
    B
    = board temperature (oC)
    P
    D
    = power dissipation in package
    If the board temperature is known and the heat loss from the package case to the air can be ignored,
    acceptable predictions of junction temperature can be made. For this method to work, the board and board
    mounting must be similar to the test board used to determine the junction-to-board thermal resistance,
    namely a 2s2p (board with a power and a ground plane) and by attaching the thermal balls to the ground
    plane.
    4.4
    Estimation Using Simulation
    When the board temperature is not known, a thermal simulation of the application is needed. The simple
    two-resistor model can be used with the thermal simulation of the application, or a more accurate and
    complex model of the package can be used in the thermal simulation.
    F
    Freescale Semiconductor, Inc.
    n
    .
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