參數(shù)資料
型號(hào): MPC8270ZQMIBA
廠商: Freescale Semiconductor
文件頁數(shù): 75/83頁
文件大?。?/td> 0K
描述: IC MPU POWERQUICC II 516-PBGA
標(biāo)準(zhǔn)包裝: 40
系列: MPC82xx
處理器類型: 32-位 MPC82xx PowerQUICC II
速度: 333MHz
電壓: 1.5V
安裝類型: 表面貼裝
封裝/外殼: 516-BBGA
供應(yīng)商設(shè)備封裝: 516-FPBGA(27x27)
包裝: 托盤
MPC8280 PowerQUICC II Family Hardware Specifications, Rev. 2
Freescale Semiconductor
77
Package Description
9.2
Mechanical Dimensions
This figure provides the mechanical dimensions and bottom surface nomenclature of the 480 TBGA
Figure 17. Mechanical Dimensions and Bottom Surface Nomenclature—480 TBGA
Dim
Millimeters
Min
Max
A
1.45
1.65
A1
0.60
0.70
A2
0.85
0.95
A3
0.25
b
0.65
0.85
D
37.50 BSC
D1
35.56 REF
e
1.27 BSC
E
37.50 BSC
E1
35.56 REF
Notes:
1. Dimensions and Tolerancing per ASME Y14.5M-1994.
2. Dimensions in millimeters.
3. Dimension b is measured at the maximum solder ball diameter, parallel to primary data A.
4. Primary data A and the seating plane are defined by the spherical crowns of the solder balls.
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