參數(shù)資料
型號(hào): MPC8270CZQMIBA
廠商: Freescale Semiconductor
文件頁(yè)數(shù): 74/83頁(yè)
文件大?。?/td> 0K
描述: IC MPU POWERQUICC II 516-PBGA
標(biāo)準(zhǔn)包裝: 40
系列: MPC82xx
處理器類型: 32-位 MPC82xx PowerQUICC II
速度: 333MHz
電壓: 1.5V
安裝類型: 表面貼裝
封裝/外殼: 516-BBGA
供應(yīng)商設(shè)備封裝: 516-FPBGA(27x27)
包裝: 托盤
MPC8280 PowerQUICC II Family Hardware Specifications, Rev. 2
76
Freescale Semiconductor
Package Description
9.1
Package Parameters
This table provides package parameters.
NOTE: Temperature Reflow for the VR Package
In the VR package, sphere composition is lead-free (see Table 2). This
requires higher temperature reflow than what is required for other
PowerQUICC II packages. Consult “Freescale PowerQUICC II Pb-Free
Packaging Information” (MPC8250PBFREEPKG) available on
www.freescale.com.
Table 26. Package Parameters
Package
SoCs
Outline
(mm)
Type
Interconnects
Pitch
(mm)
Nominal Unmounted
Height (mm)
ZU
MPC8280
MPC8270
37.5
× 37.5
TBGA
480
1.27
1.55
VV
MPC8280
MPC8270
37.5
× 37.5
TBGA
480
1.27
1.55
VR
MPC8275VR
MPC8270VR
27
× 27
PBGA
516
1
2.25
ZQ
MPC8275ZQ
MPC8270ZQ
27
× 27
PBGA
516
1
2.25
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