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參數(shù)資料
| 型號： | MPC826XACZUSPUX |
| 廠商： | Motorola, Inc. |
| 英文描述： | MPC826xA (HiP4) Family Hardware Specifications |
| 中文描述： | MPC826xA（HiP4）家庭硬件規(guī)格 |
| 文件頁數(shù)： | 12/48頁 |
| 文件大?。?/td> | 315K |
| 代理商： | MPC826XACZUSPUX |
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12
MPC826xA (HiP4) Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
MOTOROLA
Electrical and Thermal Characteristics
1.2.2
Thermal Characteristics
Table 6 describes thermal characteristics.
1.2.3
Power Considerations
The average chip-junction temperature
,
T
J
,
in
°
C can be obtained from the following:
T
J
= T
A
+ (P
D
x
θ
JA
)
(1)
where
T
A
= ambient temperature
°
C
θ
JA
= package thermal resistance
,
junction to ambient
,
°
C/W
P
D
= P
INT
+ P
I/O
P
INT
= I
DD
x
V
DD
Watts (chip internal power)
P
I/O
= power dissipation on input and output pins (determined by user)
For most applications P
I/O
< 0.3
x
P
INT
. If P
I/O
is neglected
,
an approximate relationship between P
D
and T
J
is the following:
P
D
= K/(T
J
+ 273
°
C)
(2)
Solving equations (1) and (2) for K gives:
K = P
D
x
(T
A
+ 273
°
C) +
θ
JA
x
P
D2
(3)
where K is a constant pertaining to the particular part. K can be determined from equation (3) by measuring
P
D
(at equilibrium) for a known T
A
. Using this value of K
,
the values of P
D
and T
J
can be obtained by solving
equations (1) and (2) iteratively for any value of T
A
.
1.2.3.1
Layout Practices
Each V
CC
pin should be provided with a low-impedance path to the board’s power supply. Each ground pin
should likewise be provided with a low-impedance path to ground. The power supply pins drive distinct
groups of logic on chip. The V
CC
power supply should be bypassed to ground using at least four 0.1 μF
by-pass capacitors located as close as possible to the four sides of the package. The capacitor leads and
associated printed circuit traces connecting to chip V
CC
and ground should be kept to less than half an inch
per capacitor lead. A four-layer board is recommended, employing two inner layers as V
CC
and GND planes.
Table 6. Thermal Characteristics
Characteristics
Symbol
Value
Unit
Air Flow
Thermal resistance for TBGA
θ
JA
13.07
1
1
Assumes a single layer board with no thermal vias
2
Natural convection
3
Assumes a four layer board
°
C/W
NC
2
θ
JA
9.55
1
°
C/W
1 m/s
θ
JA
10.48
3
°
C/W
NC
θ
JA
7.78
3
°
C/W
1 m/s
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