參數(shù)資料
型號(hào)： MPC8266CZU
廠(chǎng)商： Motorola, Inc.
英文描述： MPC826xA (HiP4) Family Hardware Specifications
中文描述： MPC826xA（HiP4）家庭硬件規(guī)格
文件頁(yè)數(shù)： 30/48頁(yè)
文件大?。?/td> 315K
代理商： MPC8266CZU
30
MPC826xA (HiP4) Family Hardware Specifications
MOTOROLA
Pinout
Figure 13. Pinout of the 480 TBGA Package as Viewed from the Top Surface
Figure 14 shows the side profile of the TBGA package to indicate the direction of the top surface view.
Figure 14. Side View of the TBGA Package
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Soldermask
Copper Traces
Die
Attach
Copper Heat Spreader
(Oxidized for Insulation)
1.27 mm Pitch
Glob-Top Dam
Etched
Cavity
Pressure Sensitive
Adhesive
Die
Glob-Top Filled Area
Polymide Tape
View
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