參數(shù)資料
            型號: MPC8264AZUMHBB
            廠商: Freescale Semiconductor
            文件頁數(shù): 28/50頁
            文件大?。?/td> 0K
            描述: IC MPU POWERQUICC II 480-TBGA
            標準包裝: 21
            系列: MPC82xx
            處理器類型: 32-位 MPC82xx PowerQUICC II
            速度: 266MHz
            電壓: 2V
            安裝類型: 表面貼裝
            封裝/外殼: 480-LBGA
            供應(yīng)商設(shè)備封裝: 408-TBGA(37.5x37.5)
            包裝: 托盤
            MPC8260A PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2.0
            34
            Freescale Semiconductor
            Pinout
            Figure 14 shows the side profile of the TBGA package to indicate the direction of the top surface view.
            Figure 14. Side View of the TBGA Package
            Table 21 shows the pinout list of the MPC826xA. Table 20 defines conventions and acronyms used in
            Symbols used in Table 21 are described in Table 20.
            Table 20. Symbol Legend
            Symbol
            Meaning
            OVERBAR
            Signals with overbars, such as TA, are active low.
            UTM
            Indicates that a signal is part of the UTOPIA master interface.
            UTS
            Indicates that a signal is part of the UTOPIA slave interface.
            UT8
            Indicates that a signal is part of the 8-bit UTOPIA interface.
            UT16
            Indicates that a signal is part of the 16-bit UTOPIA interface.
            MII
            Indicates that a signal is part of the media independent interface.
            Table 21. Pinout List
            Pin Name
            Ball
            BR
            W5
            BG
            F4
            ABB/IRQ2
            E2
            TS
            E3
            A0
            G1
            A1
            H5
            A2
            H2
            A3
            H1
            A4
            J5
            A5
            J4
            A6
            J3
            A7
            J2
            Soldermask
            Copper Traces
            Die
            Copper Heat Spreader
            (Oxidized for Insulation)
            1.27 mm Pitch
            Glob-Top Dam
            Wire Bonds
            Etched
            Pressure Sensitive
            Die
            Glob-Top Filled Area
            Polymide Tape
            Cavity
            Adhesive
            Attach
            View
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