- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄371135 > MPC8264ACZU (Motorola, Inc.) MPC826xA (HiP4) Family Hardware Specifications PDF資料下載
參數(shù)資料
| 型號： | MPC8264ACZU |
| 廠商： | Motorola, Inc. |
| 英文描述： | MPC826xA (HiP4) Family Hardware Specifications |
| 中文描述： | MPC826xA（HiP4）家庭硬件規(guī)格 |
| 文件頁數(shù)： | 11/48頁 |
| 文件大?。?/td> | 315K |
| 代理商： | MPC8264ACZU |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁當前第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁
MOTOROLA
MPC826xA (HiP4) Family Hardware Specifications
11
Electrical and Thermal Characteristics
1.2.2
Thermal Characteristics
Table 4 describes thermal characteristics.
1.2.3
Power Considerations
The average chip-junction temperature
,
T
J
,
in
°
C can be obtained from the following:
T
J
= T
A
+ (P
D
x
θ
JA
)
(1)
where
T
A
= ambient temperature
°
C
θ
JA
= package thermal resistance
,
junction to ambient
,
°
C/W
P
D
= P
INT
+ P
I/O
P
INT
= I
DD
x
V
DD
Watts (chip internal power)
P
I/O
= power dissipation on input and output pins (determined by user)
For most applications P
I/O
< 0.3
x
P
INT
. If P
I/O
is neglected
,
an approximate relationship between P
D
and T
J
is the following:
P
D
= K/(T
J
+ 273
°
C)
(2)
Solving equations (1) and (2) for K gives:
K = P
D
x
(T
A
+ 273
°
C) +
θ
JA
x
P
D2
(3)
where K is a constant pertaining to the particular part. K can be determined from equation (3) by measuring
P
D
(at equilibrium) for a known T
A
. Using this value of K
,
the values of P
D
and T
J
can be obtained by solving
equations (1) and (2) iteratively for any value of T
A
.
Table 4. Thermal Characteristics for 480 TBGA Package
Characteristics
Symbol
Value
Unit
Air Flow
Junction to ambient
θ
JA
13
1
1
Assumes a single layer board with no thermal vias
2
Natural convection
3
Assumes a four layer board
4
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature
is measured on the top surface of the board near the package.
5
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1).
°
C/W
NC
2
10
1
1 m/s
11
3
NC
8
3
1 m/s
Junction to board
4
θ
JB
4
°
C/W
—
Junction to case
5
θ
JC
1.1
°
C/W
—
相關PDF資料 |
PDF描述 |
|---|---|
| MPC8264AZU | MPC826xA (HiP4) Family Hardware Specifications |
| MPC8264CZU | MPC826xA (HiP4) Family Hardware Specifications |
| MPC8265ACZU | MPC826xA (HiP4) Family Hardware Specifications |
| MPC8265CZU | MPC826xA (HiP4) Family Hardware Specifications |
| MPC8266ACZU | MPC826xA (HiP4) Family Hardware Specifications |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| MPC8264ACZUMIBB | 功能描述:微處理器 - MPU POWERQUICC II HIP4 REV B RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8264AVR | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:MPC826xA (HiP4) Family Hardware Specifications |
| MPC8264AVVMHBB | 功能描述:微處理器 - MPU PQ II HIP4 REV B RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8264AVVPIBB | 功能描述:微處理器 - MPU PQ II HIP4 REV B RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8264AVVPJDB | 功能描述:微處理器 - MPU PQ II HIP4 REV B RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
發(fā)布緊急采購，3分鐘左右您將得到回復。