參數(shù)資料
型號(hào)： MPC8260AEC
廠商： Motorola, Inc.
英文描述： MPC826xA (HiP4) Family Hardware Specifications
中文描述： MPC826xA（HiP4）家庭硬件規(guī)格
文件頁數(shù)： 12/48頁
文件大?。?/td> 315K
代理商： MPC8260AEC
12
MPC826xA (HiP4) Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
MOTOROLA
Electrical and Thermal Characteristics
1.2.2
Thermal Characteristics
Table 6 describes thermal characteristics.
1.2.3
Power Considerations
The average chip-junction temperature
,
T
J
,
in
°
C can be obtained from the following:
T
J
= T
A
+ (P
D
x
θ
JA
)
(1)
where
T
A
= ambient temperature
°
C
θ
JA
= package thermal resistance
,
junction to ambient
,
°
C/W
P
D
= P
INT
+ P
I/O
P
INT
= I
DD
x
V
DD
Watts (chip internal power)
P
I/O
= power dissipation on input and output pins (determined by user)
For most applications P
I/O
< 0.3
x
P
INT
. If P
I/O
is neglected
,
an approximate relationship between P
D
and T
J
is the following:
P
D
= K/(T
J
+ 273
°
C)
(2)
Solving equations (1) and (2) for K gives:
K = P
D
x
(T
A
+ 273
°
C) +
θ
JA
x
P
D2
(3)
where K is a constant pertaining to the particular part. K can be determined from equation (3) by measuring
P
D
(at equilibrium) for a known T
A
. Using this value of K
,
the values of P
D
and T
J
can be obtained by solving
equations (1) and (2) iteratively for any value of T
A
.
1.2.3.1
Layout Practices
Each V
CC
pin should be provided with a low-impedance path to the board’s power supply. Each ground pin
should likewise be provided with a low-impedance path to ground. The power supply pins drive distinct
groups of logic on chip. The V
CC
power supply should be bypassed to ground using at least four 0.1 μF
by-pass capacitors located as close as possible to the four sides of the package. The capacitor leads and
associated printed circuit traces connecting to chip V
CC
and ground should be kept to less than half an inch
per capacitor lead. A four-layer board is recommended, employing two inner layers as V
CC
and GND planes.
Table 6. Thermal Characteristics
Characteristics
Symbol
Value
Unit
Air Flow
Thermal resistance for TBGA
θ
JA
13.07
1
1
Assumes a single layer board with no thermal vias
2
Natural convection
3
Assumes a four layer board
°
C/W
NC
2
θ
JA
9.55
1
°
C/W
1 m/s
θ
JA
10.48
3
°
C/W
NC
θ
JA
7.78
3
°
C/W
1 m/s
相關(guān)PDF資料
PDF描述
MPC826XACZUBUS MPC826xA (HiP4) Family Hardware Specifications
MPC826XACZUBUSX MPC826xA (HiP4) Family Hardware Specifications
MPC826XACZUSPM MPC826xA (HiP4) Family Hardware Specifications
MPC826XACZUSPMX MPC826xA (HiP4) Family Hardware Specifications
MPC826XACZUSPU MPC826xA (HiP4) Family Hardware Specifications
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8260AVR 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:MPC826xA (HiP4) Family Hardware Specifications
MPC8260AVVMHBB 功能描述:微處理器 - MPU PQ II HIP4 REV B RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8260AVVPIBB 功能描述:微處理器 - MPU PQ II HIP4 REV B RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8260AVVPJDB 功能描述:微處理器 - MPU PQ II HIP4 REV B RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8260AZU 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:MPC826xA (HiP4) Family Hardware Specifications
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購

我的聯(lián)系方式

*
*
*