- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄45355 > MPC8255ZUPIBX (MOTOROLA INC) 32-BIT, 300 MHz, RISC PROCESSOR, PBGA480 PDF資料下載
參數(shù)資料
| 型號： | MPC8255ZUPIBX |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 300 MHz, RISC PROCESSOR, PBGA480 |
| 封裝： | 37.50 X 37.50 MM, 1.55 MM HEIGHT, 1.27 MM PITCH, TBGA-480 |
| 文件頁數(shù)： | 36/36頁 |
| 文件大?。?/td> | 683K |
| 代理商： | MPC8255ZUPIBX |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁當(dāng)前第36頁
MOTOROLA
MPC8255 Hardware Specifications
9
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Electrical and Thermal Characteristics
1.2.2
Thermal Characteristics
Table 4 describes thermal characteristics.
1.2.3
Power Considerations
The average chip-junction temperature, TJ, in °C can be obtained from the following:
TJ = TA + (PD x θJA)
(1)
where
TA = ambient temperature °C
θ
JA = package thermal resistance, junction to ambient, °C/W
PD = PINT + PI/O
PINT = IDD x VDD Watts (chip internal power)
PI/O = power dissipation on input and output pins (determined by user)
For most applications PI/O < 0.3 x PINT. If PI/O is neglected, an approximate relationship between PD and TJ
is the following:
PD = K/(TJ + 273° C)
(2)
Solving equations (1) and (2) for K gives:
K = PD x (TA + 273° C) + θJA x PD
2
(3)
where K is a constant pertaining to the particular part. K can be determined from equation (3) by measuring
PD (at equilibrium) for a known TA. Using this value of K, the values of PD and TJ can be obtained by solving
equations (1) and (2) iteratively for any value of TA.
1.2.3.1
Layout Practices
Each VCC pin should be provided with a low-impedance path to the board’s power supply. Each ground pin
should likewise be provided with a low-impedance path to ground. The power supply pins drive distinct
groups of logic on chip. The VCC power supply should be bypassed to ground using at least four 0.1 F
by-pass capacitors located as close as possible to the four sides of the package. The capacitor leads and
associated printed circuit traces connecting to chip VCC and ground should be kept to less than half an inch
per capacitor lead. A four-layer board is recommended, employing two inner layers as VCC and GND planes.
Table 4. Thermal Characteristics
Characteristics
Symbol
Value
Unit
Air Flow
Thermal resistance for TBGA
θ
JA
13.071
1 Assumes a single layer board with no thermal vias
°C/W
NC2
2 Natural convection
θ
JA
9.551
°C/W
1 m/s
θ
JA
10.483
3 Assumes a four layer board
°C/W
NC
θ
JA
7.783
°C/W
1 m/s
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MPC8255ACZUMHBB | 32-BIT, 266 MHz, RISC PROCESSOR, PBGA480 |
| MPC8255AZUIHBX | 32-BIT, 200 MHz, RISC PROCESSOR, PBGA480 |
| MPC8255ACZUIHBX | 32-BIT, 200 MHz, RISC PROCESSOR, PBGA480 |
| MPC8255ACZUNJDX | 32-BIT, 291 MHz, RISC PROCESSOR, PBGA480 |
| MPC8255ZUIFBX | 32-BIT, 200 MHz, RISC PROCESSOR, PBGA480 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC8260 | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:MPC826xA (HiP4) Family Hardware Specifications |
| MPC8260A | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC⑩ II Integrated Communications Processor Hardware Specifications |
| MPC8260ACVR | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:MPC826xA (HiP4) Family Hardware Specifications |
| MPC8260ACVVMHBB | 功能描述:微處理器 - MPU PQ II HIP4 REV B RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8260ACVVMIBB | 功能描述:微處理器 - MPU PQ II HIP4 REV B RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。