參數(shù)資料
型號(hào): MPC8241TZQ166D
廠商: Freescale Semiconductor
文件頁(yè)數(shù): 43/58頁(yè)
文件大小: 0K
描述: IC MPU 32BIT 166MHZ 357-PBGA
標(biāo)準(zhǔn)包裝: 44
系列: MPC82xx
處理器類(lèi)型: 32-位 MPC82xx PowerQUICC II
速度: 166MHz
電壓: 1.8V
安裝類(lèi)型: 表面貼裝
封裝/外殼: 357-BBGA
供應(yīng)商設(shè)備封裝: 357-PBGA(25x25)
包裝: 托盤(pán)
MPC8241 Integrated Processor Hardware Specifications, Rev. 10
48
Freescale Semiconductor
System Design Information
Figure 29. Die Junction-to-Ambient Resistance
The board designer can choose among several types of heat sinks to place on the MPC8241. Several
commercially available heat sinks for the MPC8241 are provided by the following vendors:
Aavid Thermalloy
603-224-9988
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Alpha Novatech
408-749-7601
473 Sapena Ct. #15
Santa Clara, CA 95054
Internet: www.alphanovatech.com
International Electronic Research Corporation (IERC) 818-842-7277
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Tyco Electronics
800-522-6752
Chip Coolers
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
Wakefield Engineering
603-635-5102
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
Selection of an appropriate heat sink depends on thermal performance at a given air velocity, spatial
volume, mass, attachment method, assembly, and cost. Other heat sinks offered by Aavid Thermalloy,
Alpha Novatech, IERC, Chip Coolers, and Wakefield Engineering offer different heat sink-to-ambient
thermal resistances, and may or may not need airflow.
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