參數(shù)資料
型號(hào)： MPC8241LZQ200D
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 42/58頁(yè)
文件大?。?/td> 0K
描述： IC MPU 32BIT 200MHZ PPC 357-PBGA
標(biāo)準(zhǔn)包裝： 44
系列： MPC82xx
處理器類(lèi)型： 32-位 MPC82xx PowerQUICC II
速度： 200MHz
電壓： 1.8V
安裝類(lèi)型： 表面貼裝
封裝/外殼： 357-BBGA
供應(yīng)商設(shè)備封裝： 357-PBGA（25x25）
包裝： 托盤(pán)
MPC8241 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
47
System Design Information
7.7
Thermal Management
This section provides thermal management information for the plastic ball grid array (PBGA) package for
air-cooled applications. Depending on the application environment and the operating frequency, a heat
sink may be required to maintain junction temperature within specifications. Proper thermal control design
primarily depends on the system-level design: heat sink, airflow, and thermal interface material. To reduce
the die-junction temperature, heat sinks can be attached to the package by several methods: adhesive,
spring clip to holes in the printed-circuit board or package, or mounting clip and screw assembly (see
Figure 28. Package Exploded Cross-Sectional View with Several Heat Sink Options
Figure 29 depicts the die junction-to-ambient thermal resistance for four typical cases:
A heat sink is not attached to the PBGA package and a high board-level thermal loading from
adjacent components exists (label used—1s).
A heat sink is not attached to the PBGA package and a low board-level thermal loading from
adjacent components exists (label used—2s2p).
A large heat sink (cross cut extrusion, 38
× 38 × 16.5 mm) is attached to the PBGA package and a
high board-level thermal loading from adjacent components exists (label used—1s/sink).
A large heat sink (cross cut extrusion, 38
× 38 × 16.5 mm) is attached to the PBGA package and a
low board-level thermal loading from adjacent components exists (label used—2s2p/sink).
Adhesive or
Thermal Interface
Heat Sink
PBGA Package
Heat Sink
Clip
Printed-Circuit Board
Option
Material
Die
Wire
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8241LZQ200D 制造商:Freescale Semiconductor 功能描述:IC 32BIT MPU 200MHZ BGA-357
MPC8241LZQ266D 功能描述:微處理器 - MPU 266MHz 266MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8241TVR166D 功能描述:微處理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8241TVR200D 功能描述:微處理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8241TZP166C 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:Intergrated Processor Hardware Specifications
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