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參數(shù)資料
| 型號： | MPC745BPX400LX |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 400 MHz, RISC PROCESSOR, PBGA255 |
| 封裝： | 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-255 |
| 文件頁數(shù)： | 36/48頁 |
| 文件大?。?/td> | 1265K |
| 代理商： | MPC745BPX400LX |
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MPC755 RISC Microprocessor Hardware Specifications
41
System Design Information
1.8.9 Thermal Management Information
This section provides thermal management information for the ceramic ball grid array (CBGA) package for
air-cooled applications. Proper thermal control design is primarily dependent upon the system-level
design—the heat sink, airflow and thermal interface material. To reduce the die-junction temperature, heat
sinks may be attached to the package by several methods—adhesive, spring clip to holes in the
printed-circuit board or package, and mounting clip and screw assembly; see Figure 27. This spring force
should not exceed 5.5 pounds of force.
Figure 27 describes the package exploded cross-sectional view with several heat sink options.
Figure 27. Package Exploded Cross-Sectional View with Several Heat Sink Options
The board designer can choose between several types of heat sinks to place on the MPC755. There are
several commercially-available heat sinks for the MPC755 provided by the following vendors:
Chip Coolers Inc.
800-227-0254 (USA/Canada)
333 Strawberry Field Rd.
401-739-7600
Warwick, RI 02887-6979
International Electronic Research Corporation (IERC)
818-842-7277
10
N/A
11
SRESET
Merge with on-board SRESET, if any.
12
N/A
13
HRESET
Merge with on-board HRESET.
14
N/A
Key location; pin should be removed.
15
CKSTP_OUT
Add 10k pullup to OVDD.
16
Ground
Digital Ground
Table 19. COP Pin Definitions (Continued)
Pins
Signal
Connection
Special Notes
Adhesive
or
Thermal Interface Material
Heat Sink
CBGA Package
Heat Sink
Clip
Printed-Circuit Board
Option
相關PDF資料 |
PDF描述 |
|---|---|
| MPC755BPX300LX | 32-BIT, 300 MHz, RISC PROCESSOR, PBGA360 |
| MPC755BRX400LX | 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360 |
| MPC755BRX450LE | 32-BIT, 450 MHz, RISC PROCESSOR, CBGA360 |
| MPC755CPX400 | 32-BIT, 400 MHz, RISC PROCESSOR, PBGA360 |
| MPC755BVT300 | 32-BIT, 300 MHz, RISC PROCESSOR, PBGA360 |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| MPC745BVT300LE | 功能描述:微處理器 - MPU GF REV2.8105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC745BVT350LE | 功能描述:微處理器 - MPU GF REV2.8105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC745CPX350LE | 功能描述:微處理器 - MPU GF REV 2.8 105C 6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC745CPX350LE | 制造商:Freescale Semiconductor 功能描述:IC 32-BIT MPU 350MHZ 255-FCPBGA |
| MPC745CVT350LE | 功能描述:微處理器 - MPU GF REV2.8@6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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