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參數(shù)資料
| 型號： | MPC603E7TEC |
| 廠商： | Motorola, Inc. |
| 英文描述： | PowerPC 603e RISC Microprocessor |
| 中文描述： | RISC微處理器的PowerPC 603e |
| 文件頁數(shù)： | 32/36頁 |
| 文件大?。?/td> | 551K |
| 代理商： | MPC603E7TEC |
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32
PID7t-603e Hardware Specifications
System Design Information
Figure 18. Thermalloy #2328B Heat Sink-to-Ambient Thermal Resistance Versus Airflow Velocity
Assuming an air velocity of 0.5 m/s, we have an effective R
sa
of 7 C/W, thus
T
j
= 30C + 5C + (0.095 C/W +1.0 C/W + 7 C/W) * 3.0 W,
resulting in a die-junction temperature of approximately 60 C which is well within the maximum operating
temperature of the component.
For a PBGA package, and assuming a T
a
of 30 C, a T
r
of 5 C a PBGA package
q
jc
= 8, and a power
consumption (P
d
) of 3.0 Watts, the following expression for T
j
is obtained:
Die-junction temperature: T
j
= 30 C + 5 C + (8 C/W + 1.0 C/W + R
sa
) * 3.0 W
Assuming an air velocity of 0.5 m/s, we have an effective R
sa
of 7 C/W, thus
T
j
= 30C + 5C + (8 C/W +1.0 C/W + 7 C/W) * 3.0 W,
resulting in a die-junction temperature of approximately 83 C which is well within the maximum operating
temperature of the component.
Other heat sinks offered by Chip Coolers, IERC, Thermalloy, WakeTeld Engineering, and Aavid
Engineering offer different heat sink-to-ambient thermal resistances, and may or may not need air ow.
Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances are a common
Tgure-of-merit used for comparing the thermal performance of various microelectronic packaging
technologies, one should exercise caution when only using this metric in determining thermal management
because no single parameter can adequately describe three-dimensional heat ow. The Tnal die-junction
operating temperature, is not only a function of the component-level thermal resistance, but the system-level
1
3
5
7
8
0
0.5
1
1.5
2
2.5
3
3.5
Thermalloy #2328B Pin-fin Heat Sink
(25 x28 x 15 mm)
Approach Air Velocity (m/s)
H
2
4
6
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.
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參數(shù)描述 |
|---|---|
| MPC603E7TED | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:PowerPC 603e RISC Microprocessor |
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| MPC603EFE100TN | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:PowerPC 603e RISC Microprocessor Family: PID6-603e (Stretch) Part Number Specifications |
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| MPC603EFE133TN | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:PowerPC 603e RISC Microprocessor Family: PID6-603e (Stretch) Part Number Specifications |
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