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參數(shù)資料
| 型號： | MPC5602DMLHR |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, FLASH, 48 MHz, MICROCONTROLLER, PQFP64 |
| 封裝： | 10 X 10 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, MS-026BCD, LQFP-64 |
| 文件頁數(shù)： | 17/77頁 |
| 文件大?。?/td> | 686K |
| 代理商： | MPC5602DMLHR |
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MPC5602D Microcontroller Data Sheet, Rev. 3.1
Preliminary—Subject to Change Without Notice
Electrical characteristics
Freescale Semiconductor
24
4.6
Thermal characteristics
4.6.1
Package thermal characteristics
Table 10. LQFP thermal characteristics1
1 Thermal characteristics are targets based on simulation that are subject to change per device characterization.
Symbol
C
Parameter
Conditions2
2 V
DD = 3.3 V ± 10% / 5.0 V ± 10%, TA = –40 to 125 °C
Pin count
Value3
3 All values need to be confirmed during device validation.
Unit
RJA CC
D
Thermal resistance,
junction-to-ambient natural
convection4
4 Junction-to-ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board
meets JEDEC specification for this package. When Greek letters are not available, the symbols are typed as RthJA
and RthJMA.
Single-layer board —1s
64
72.1
°C/W
100
65.2
Four-layer board — 2s2p
64
57.3
100
51.8
RJB CC
D
Thermal resistance,
junction-to-board5
5 Junction-to-board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC
specification for the specified package. When Greek letters are not available, the symbols are typed as RthJB.
Single-layer board — 1s
64
45.6
°C/W
100
42.6
Four-layer board — 2s2p
64
44.1
100
41.3
RJC CC
D
Thermal resistance,
junction-to-case6
6 Junction-to-case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate
temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer.
When Greek letters are not available, the symbols are typed as RthJC.
Single-layer board — 1s
64
26.5
°C/W
100
23.9
Four-layer board — 2s2p
64
26.2
100
23.7
JB
CC
D
Junction-to-board thermal
characterization parameter, natural
convection
Single-layer board — 1s
64
41
°C/W
100
41.6
Four-layer board — 2s2p
64
43
100
43.4
JC
CC
D
Junction-to-case thermal
characterization parameter, natural
convection
Single-layer board — 1s
64
11.5
°C/W
100
10.4
Four-layer board — 2s2p
64
11.1
100
10.2
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