參數(shù)資料
型號: MPC5602BF1CLH6
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: MICROCONTROLLER, PQFP64
封裝: 10 X 10 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, MS-026BCD, LQFP-64
文件頁數(shù): 40/106頁
文件大小: 1693K
代理商: MPC5602BF1CLH6
Electrical characteristics
MPC5604B/C Microcontroller Data Sheet, Rev. 8
Freescale Semiconductor
39
JC
CC
D
Junction-to-case thermal
characterization parameter,
natural convection
Single-layer board - 1s
64
TBD
°C/W
100
9
144
10
Four-layer board - 2s2p
64
TBD
100
9
144
10
1 Thermal characteristics are based on simulation.
2 V
DD = 3.3 V ± 10% / 5.0 V ± 10%, TA = -40 to 125 °C
3 Junction-to-ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test
board meets JEDEC specification for this package.
4 Junction-to-board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC
specification for the specified package.
5 Junction-to-case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate
temperature is used for the case temperature. Reported value includes the thermal resistance of the interface
layer.
Table 10. LQFP thermal characteristics1 (continued)
Symbol
C
Parameter
Conditions2
Pin count
Value
Unit
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