參數(shù)資料
型號(hào)： MPC5566MVR132
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 45/66頁(yè)
文件大?。?/td> 0K
描述： MCU 3MB FLASH 132MHZ 416-PBGA
標(biāo)準(zhǔn)包裝： 200
系列： MPC55xx Qorivva
核心處理器： e200z6
芯體尺寸： 32-位
速度： 132MHz
連通性： CAN，EBI/EMI，以太網(wǎng)，SCI，SPI
外圍設(shè)備： DMA，POR，PWM，WDT
輸入/輸出數(shù)： 256
程序存儲(chǔ)器容量： 3MB（3M x 8）
程序存儲(chǔ)器類型： 閃存
RAM 容量： 128K x 8
電壓 - 電源 (Vcc/Vdd)： 1.35 V ~ 1.65 V
數(shù)據(jù)轉(zhuǎn)換器： A/D 40x12b
振蕩器型： 外部
工作溫度： -40°C ~ 125°C
封裝/外殼： 416-BBGA
包裝： 托盤
Electrical Characteristics
MPC5566 Microcontroller Data Sheet, Rev. 3
Freescale
5
3.2
Thermal Characteristics
The shaded rows in the following table indicate information specific to a four-layer board.
28
Maximum solder temperature 11
Lead free (Pb-free)
Leaded (SnPb)
TSDR
—
260.0
245.0
oC
29
Moisture sensitivity level 12
MSL
—
3
1 Functional operating conditions are given in the DC electrical specifications. Absolute maximum ratings are stress ratings only,
and functional operation at the maxima is not guaranteed. Stress beyond any of the listed maxima can affect device reliability
or cause permanent damage to the device.
2 1.5 V ± 10% for proper operation. This parameter is specified at a maximum junction temperature of 150 oC.
3 All functional non-supply I/O pins are clamped to VSS and VDDE, or VDDEH.
4 AC signal overshoot and undershoot of up to ± 2.0 V of the input voltages is permitted for an accumulative duration of
60 hours over the complete lifetime of the device (injection current not limited for this duration).
5 Internal structures hold the voltage greater than –1.0 V if the injection current limit of 2 mA is met. Keep the negative DC
voltage greater than –0.6 V on eTPUB[15] and SINB during the internal power-on reset (POR) state.
6 Internal structures hold the input voltage less than the maximum voltage on all pads powered by VDDEH supplies, if the
maximum injection current specification is met (2 mA for all pins) and VDDEH is within the operating voltage specifications.
7 Internal structures hold the input voltage less than the maximum voltage on all pads powered by VDDE supplies, if the maximum
injection current specification is met (2 mA for all pins) and VDDE is within the operating voltage specifications.
8 Total injection current for all pins (including both digital and analog) must not exceed 25 mA.
9 Total injection current for all analog input pins must not exceed 15 mA.
10 Lifetime operation at these specification limits is not guaranteed.
11 Moisture sensitivity profile per IPC/JEDEC J-STD-020D.
12 Moisture sensitivity per JEDEC test method A112.
Table 3. MPC5566 Thermal Characteristics
Spec
MPC5566 Thermal Characteristic
Symbol
416 PBGA
Unit
1
Junction to ambient, natural convection (one-layer board) 1, 2
1 Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other board components, and board thermal resistance.
2 Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
RJA
24
°C/W
2
Junction to ambient, natural convection (four-layer board 2s2p) 1, 3
3 Per JEDEC JESD51-6 with the board horizontal.
RJA
16
°C/W
3
Junction to ambient (@200 ft./min., one-layer board)
RJMA
18
°C/W
4
Junction to ambient (@200 ft./min., four-layer board 2s2p)
RJMA
13
°C/W
5
Junction to board (four-layer board 2s2p) 4
4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
RJB
8
°C/W
6
Junction to case 5
5 Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method
(MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.
RJC
6°C/W
7
Junction to package top, natural convection 6
6 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2.
JT
2°C/W
Table 2. Absolute Maximum Ratings 1 (continued)
Spec
Characteristic
Symbol
Min.
Max.
Unit
相關(guān)PDF資料
PDF描述
MPC561CVR40 IC MPU 32BIT 40MHZ 388-PBGA
MPC562CZP40 IC MPU 32BIT W/CODE COMP 388PBGA
MPC566CZP40 IC MPU FLASH 32BIT 1M 388-PBGA
MPC603RRX300LC IC MPU POWERPC 300MHZ 255-CBGA
MPC603RVG300LC MPU RISC PID7V-603E 255FCCBGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC5566MZP132 功能描述:32位微控制器 - MCU 3M FLASH,32K CACHE 128K RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:90 MHz 程序存儲(chǔ)器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT
MPC5566MZP132R 制造商:Freescale Semiconductor 功能描述:32-BIT MPC55XX POWERPC RISC 3MB FLASH 1.8V/2.5V/3.3V/5V 416 - Tape and Reel
MPC5566MZP144 功能描述:32位微控制器 - MCU 3M FLASH32K CACHE 128K RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:90 MHz 程序存儲(chǔ)器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT
MPC5567 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Microcontroller
MPC5567EVB 功能描述:BOARD EVALUATION MPC5567MZP132 RoHS:否 類別:編程器，開發(fā)系統(tǒng) >> 過時(shí)/停產(chǎn)零件編號(hào) 系列:- 標(biāo)準(zhǔn)包裝:1 系列:- 傳感器類型:CMOS 成像，彩色（RGB） 傳感范圍:WVGA 接口:I²C 靈敏度:60 fps 電源電壓:5.7 V ~ 6.3 V 嵌入式:否 已供物品:成像器板 已用 IC / 零件:KAC-00401 相關(guān)產(chǎn)品:4H2099-ND - SENSOR IMAGE WVGA COLOR 48-PQFP4H2094-ND - SENSOR IMAGE WVGA MONO 48-PQFP
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*