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Electrical Characteristics
MPC5534 Microcontroller Data Sheet, Rev. 0
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
5
3.2
Thermal Characteristics
27
Storage Temperature Range
Maximum Solder Temperature
13
Moisture Sensitivity Level
14
T
STG
T
SDR
MSL
– 55.0
150.0
o
C
28
—
260.0
o
C
29
—
3
1
Functional operating conditions are given in the DC electrical specifications. Absolute maximum ratings are stress ratings only,
and functional operation at the maxima is not guaranteed. Stress beyond the listed maxima may affect device reliability or
cause permanent damage to the device.
2
Absolute maximum voltages are currently maximum burn-in voltages. Absolute maximum specifications for device stress have
not yet been determined.
3
1.5V +/– 10% for proper operation. This parameter is specified at a maximum junction temperature of 150C.
4
All functional non-supply I/O pins are clamped to VSS and VDDE or VDDEH.
5
AC signal over and undershoot of the input voltages of up to +/– 2.0 volts is permitted for a cumulative duration of 60 hours
over the complete lifetime of the device (injection current does not need to be limited for this duration).
6
Internal structures will hold the voltage above –1.0 volt if the injection current limit of 2 mA is met.
7
Internal structures will not clamp to a safe voltage. External protection must be used to ensure that voltage on the pin stays
above –0.3 volts.
8
Internal structures hold the input voltage below this maximum voltage on all pads powered by VDDEH supplies, if the maximum
injection current specification is met (2 mA for all pins) and VDDEH is within Operating Voltage specifications.
9
Internal structures hold the input voltage below this maximum voltage on all pads powered by VDDE supplies, if the maximum
injection current specification is met (2 mA for all pins) and VDDE is within Operating Voltage specifications.
10
Total injection current for all pins (including both digital and analog) must not exceed 25mA.
11
Total injection current for all analog input pins must not exceed 15mA.
12
Lifetime operation at these specification limits is not guaranteed.
13
Solder profile per CDF-AEC-Q100.
14
Moisture sensitivity per JEDEC test method A112.
Table 3. Thermal Characteristics
Num
Characteristic
Symbol
Unit
Value
208 MAPBGA
324 PBGA
1
Junction to Ambient
1, 2
Natural Convection
(Single layer board)
Junction to Ambient
1, 3
Natural Convection
(Four layer board 2s2p)
R
θ
JA
°C/W
42
34
2
R
θ
JA
°C/W
26
23
3
Junction to Ambient
(@200 ft./min.,
Single layer board)
R
θ
JMA
°C/W
34
28
4
Junction to Ambient
(@200 ft./min.,
Four layer board 2s2p)
Junction to Board
4
(Four layer board 2s2p)
R
θ
JMA
°C/W
22
20
5
R
θ
JB
°C/W
15
15
Table 2. Absolute Maximum Ratings
1
(continued)
Num
Characteristic
Symbol
Min
Max
2
Unit