| 型號: | MPC2004 |
| 廠商: | Motorola, Inc. |
| 英文描述: | 256KB and 512KB BurstRAM Secondary Cache Modules for PowerPC PReP/CHRP Platforms |
| 中文描述: | 256KB和512KB的二級緩存模塊BurstRAM為PowerPC制備/ CH旺平臺 |
| 文件頁數(shù): | 1/6頁 |
| 文件大?。?/td> | 84K |
| 代理商: | MPC2004 |

相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MPC2005 | 256KB and 512KB BurstRAM Secondary Cache Modules for PowerPC PReP/CHRP Platforms |
| MPC603E | PowerPC 603e RISC Microprocessor |
| MPC958 | LOW VOLTAGE PLL CLOCK DRIVER |
| MPC9608 | 1:10 LVCMOS Zero Delay Clock Buffer |
| MPC961C | LOW VOLTAGE ZERO DELAY BUFFER |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC2005 | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:256KB and 512KB BurstRAM Secondary Cache Modules for PowerPC PReP/CHRP Platforms |
| MPC202025T | 制造商:AMEC THERMASOL 功能描述:HEAT SINK CERAMIC 20*20*2.5TD ADHESIV 制造商:AMEC THERMASOL 功能描述:HEAT SINK, CERAMIC 20*20*2.5STD ADHESIV 制造商:AMEC THERMASOL 功能描述:HEAT SINK; Thermal Resistance:10.21C/W; External Height - Imperial:0.098"; External Height - Metric:2.5mm; External Width - Imperial:0.787"; External Width - Metric:20mm; External Length - Imperial:0.787"; Heat Sink Material:Ceramic;RoHS Compliant: Yes |
| MPC2104 | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:256KB and 512KB BurstRAM Secondary Cache Modules for PowerPC PReP/CHRP Platforms |
| MPC2104P | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:256KB/512KB BurstRAM Secondary Cache Modules for PowerPC PReP/CHRP Platforms |
| MPC2104PDG66 | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:256KB/512KB BurstRAM Secondary Cache Modules for PowerPC PReP/CHRP Platforms |