- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄382345 > MP232EI (Texas Instruments, Inc.) Low Power 5V RS232 Dual Driver/Receiver with 0.1?μF Capacitors; Package: SO; No of Pins: 16; Temperature Range: -40?°C to 85?°C PDF資料下載
參數(shù)資料
| 型號： | MP232EI |
| 廠商： | Texas Instruments, Inc. |
| 元件分類： | 外設(shè)及接口 |
| 英文描述： | Low Power 5V RS232 Dual Driver/Receiver with 0.1?μF Capacitors; Package: SO; No of Pins: 16; Temperature Range: -40?°C to 85?°C |
| 中文描述： | 電可擦除可編程邏輯器件 |
| 文件頁數(shù)： | 10/18頁 |
| 文件大?。?/td> | 331K |
| 代理商： | MP232EI |
Orderable Device
Status
(1)
Package
Type
SOIC
Package
Drawing
D
Pins Package
Qty
2500 Green (RoHS &
no Sb/Br)
40
Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
90
Green (RoHS &
no Sb/Br)
90
Green (RoHS &
no Sb/Br)
90
Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
MAX3232EIDRG4
ACTIVE
16
CU NIPDAU
Level-1-260C-UNLIM
MAX3232EIDW
ACTIVE
SOIC
DW
16
CU NIPDAU
Level-1-260C-UNLIM
MAX3232EIDWR
ACTIVE
SOIC
DW
16
CU NIPDAU
Level-1-260C-UNLIM
MAX3232EIPW
ACTIVE
TSSOP
PW
16
CU NIPDAU
Level-1-260C-UNLIM
MAX3232EIPWE4
ACTIVE
TSSOP
PW
16
CU NIPDAU
Level-1-260C-UNLIM
MAX3232EIPWG4
ACTIVE
TSSOP
PW
16
CU NIPDAU
Level-1-260C-UNLIM
MAX3232EIPWR
ACTIVE
TSSOP
PW
16
CU NIPDAU
Level-1-260C-UNLIM
MAX3232EIPWRE4
ACTIVE
TSSOP
PW
16
CU NIPDAU
Level-1-260C-UNLIM
MAX3232EIPWRG4
ACTIVE
TSSOP
PW
16
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:
The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2007
Addendum-Page 2
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MPC603E7TEC | PowerPC 603e RISC Microprocessor |
| MPC603E7TED | PowerPC 603e RISC Microprocessor |
| MPC750 | Hall Effect Switch IC; Package/Case:3-SOT-23; Supply Voltage Max:24V; Current Rating:4mA; Leaded Process Compatible:Yes; Operate Point Max:90G; Operate Point Min:-90G; Operational Type:Latch; Peak Reflow Compatible (260 C):Yes RoHS Compliant: Yes |
| MPC823 | Communication Processor Module |
| MPC823UM_REV1_16-CPM7 | 10 AMP SUBMINIATURE POWER RELAY |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MP2-330 | 制造商:COOPER BUSSMANN 功能描述:Ind Power Wirewound 33uH 20% 100KHz 65Q-Factor Ferrite 640mA T/R 制造商:COOPER BUSSMANN 功能描述:Inductor Power Wirewound 33uH 20% 100KHz 65Q-Factor Ferrite 640mA 556mOhm DCR T/R |
| MP2-330-R | 功能描述:固定電感器 33uH 0.37A 0.556ohms RoHS:否 制造商:AVX 電感:10 uH 容差:20 % 最大直流電流:1 A 最大直流電阻:0.075 Ohms 工作溫度范圍:- 40 C to + 85 C 自諧振頻率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接類型:SMD/SMT 封裝 / 箱體:6.6 mm x 4.45 mm |
| MP2351 | 制造商:MPS 制造商全稱:Monolithic Power Systems 功能描述:1.5A, 23V, 1.4MHz Step-Down Converter |
| MP2351DK | 制造商:MPS 制造商全稱:Monolithic Power Systems 功能描述:1.5A, 23V, 1.4MHz Step-Down Converter |
| MP2351DK-LF | 制造商:Monolithic Power Systems 功能描述:CONV DC-DC SINGLE-OUT STEP DOWN 10-PIN MSOP - Bulk |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。