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參數(shù)資料
| 型號(hào)： | MP02XX280-20 |
| 廠商： | Dynex Semiconductor Ltd. |
| 英文描述： | Dual Diode Modules |
| 中文描述： | 雙二極管模塊 |
| 文件頁(yè)數(shù)： | 3/9頁(yè) |
| 文件大?。?/td> | 104K |
| 代理商： | MP02XX280-20 |
MP02 XX 280 Series
3/9
An even coating of thermal compound (eg. Unial) should be
applied to both the heatsink and module mounting surfaces.
This should ideally be 0.05mm (0.002") per surface to
ensure optimum thermal performance.
After application of thermal compound, place the module
squarely over the mounting holes, (or 'T' slots) in the
heatsink. Using a torque wrench, slowly tighten the
recommended fixing bolts at each end, rotating each in turn
no more than 1/4 of a revolution at a time. Continue until the
required torque of 6Nm (55lb.ins) is reached at both ends.
It is not acceptable to fully tighten one fixing bolt before
starting to tighten the others. Such action may DAMAGE the
module.
Adequate heatsinking is required to maintain the base
temperature at 75
o
C if full rated current is to be achieved.
Power dissipation may be calculated by use of V
and r
T
information in accordance with standard formulae. We can
provide assistance with calculations or choice of heatsink
if required.
The heatsink surface must be smooth and flat; a surface
finish of N6 (32
μ
min) and a flatness within 0.05mm (0.002")
are recommended.
Immediately prior to mounting, the heatsink surface should
be lightly scrubbed with fine emery, Scotch Brite or a mild
chemical etchant and then cleaned with a solvent to
remove oxide build up and foreign material. Care should be
taken to ensure no foreign particles remain.
ORDERING INSTRUCTIONS
Part number is made up of as follows:
MP02 HB 280 - 18
MP
02
HB
280
18
= Pressure contact module
= Outline type
= Circuit configuration code (see "circuit options" - front page)
= Nominal average current rating at T
case
= 75
o
C
= V
RRM
/100
Examples:
MP02HB280 - 16
MP02G280 - 20
MP02GN280 - 18
Note: Prefered type is HB configuration. G and GN types are available for specific applications, only
when requested.
MOUNTING RECOMMENDATIONS
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PDF描述 |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MP02XXX190 | 制造商:DYNEX 制造商全稱(chēng):Dynex Semiconductor 功能描述:Phase Control Dual SCR, SCR/Diode Modules |
| MP03 | 制造商:AURIS 制造商全稱(chēng):AURIS 功能描述:Quartz SMD |
| MP03/130-16 | 制造商:DYNEX 制造商全稱(chēng):Dynex Semiconductor 功能描述:Phase Control Dual SCR, SCR/Diode Modules |
| MP03/130-18 | 制造商:DYNEX 制造商全稱(chēng):Dynex Semiconductor 功能描述:Phase Control Dual SCR, SCR/Diode Modules |
| MP03/130-20 | 制造商:DYNEX 制造商全稱(chēng):Dynex Semiconductor 功能描述:Phase Control Dual SCR, SCR/Diode Modules |
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