- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄371126 > MMBD2000T1 (MOTOROLA INC) SWITCHING DIODE PDF資料下載
參數(shù)資料
| 型號： | MMBD2000T1 |
| 廠商： | MOTOROLA INC |
| 元件分類： | 參考電壓二極管 |
| 英文描述： | SWITCHING DIODE |
| 中文描述： | 0.2 A, SILICON, SIGNAL DIODE |
| 文件頁數(shù)： | 4/8頁 |
| 文件大?。?/td> | 171K |
| 代理商： | MMBD2000T1 |
4
Motorola Small–Signal Transistors, FETs and Diodes Device Data
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within a
short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
Always preheat the device.
The delta temperature between the preheat and soldering
should be 100
°
C or less.*
When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering method,
the difference should be a maximum of 10
°
C.
The soldering temperature and time should not exceed
260
°
C for more than 10 seconds.
When shifting from preheating to soldering, the maximum
temperature gradient should be 5
°
C or less.
After soldering has been completed, the device should be
allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and result
in latent failure due to mechanical stress.
Mechanical stress or shock should not be applied during
cooling
* Soldering a device without preheating can cause excessive
thermal shock and stress which can result in damage to the
device.
SOLDER STENCIL GUIDELINES
Prior to placing surface mount components onto a printed
circuit board, solder paste must be applied to the pads. A
solder stencil is required to screen the optimum amount of
solder paste onto the footprint. The stencil is made of brass
or stainless steel with a typical thickness of 0.008 inches.
The stencil opening size for the surface mounted package
should be the same as the pad size on the printed circuit
board, i.e., a 1:1 registration.
TYPICAL SOLDER HEATING PROFILE
For any given circuit board, there will be a group of control
settings that will give the desired heat pattern. The operator
must set temperatures for several heating zones, and a
figure for belt speed. Taken together, these control settings
make up a heating “profile” for that particular circuit board.
On machines controlled by a computer, the computer
remembers these profiles from one operating session to the
next. Figure 8 shows a typical heating profile for use when
soldering a surface mount device to a printed circuit board.
This profile will vary among soldering systems but it is a good
starting point. Factors that can affect the profile include the
type of soldering system in use, density and types of
components on the board, type of solder used, and the type
of board or substrate material being used. This profile shows
temperature versus time. The line on the graph shows the
actual temperature that might be experienced on the surface
of a test board at or near a central solder joint. The two
profiles are based on a high density and a low density board.
The Vitronics SMD310 convection/infrared reflow soldering
system was used to generate this profile. The type of solder
used was 62/36/2 Tin Lead Silver with a melting point
between 177–189
°
C. When this type of furnace is used for
solder reflow work, the circuit boards and solder joints tend to
heat first. The components on the board are then heated by
conduction. The circuit board, because it has a large surface
area, absorbs the thermal energy more efficiently, then
distributes this energy to the components. Because of this
effect, the main body of a component may be up to 30
degrees cooler than the adjacent solder joints.
相關PDF資料 |
PDF描述 |
|---|---|
| MMSD301T1 | SOD-123 Schottky Barrier Diodes |
| MMSD701T1 | SOD-123 Schottky Barrier Diodes |
| MMSF10N02Z | Hook-Up Wire; Conductor Size AWG:24; No. Strands x Strand Size:19 x 36; Jacket Color:Black; Approval Bodies:UL; Approval Categories:UL AWM Style 1213; Passes VW-1 Flame Test; Cable/Wire MIL SPEC:MIL-W-16878/4 Type E RoHS Compliant: Yes |
| MMSF10N03Z | SINGLE TMOS POWER MOSFET 10 AMPERES 30 VOLTS |
| MMSF2P02E | SINGLE TMOS POWER MOSFET 2.5 AMPERES 20 VOLTS |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| MMBD2004 | 制造商:WEITRON 制造商全稱:Weitron Technology 功能描述:Surface Mount Switching Diode |
| MMBD2004A | 制造商:WEITRON 制造商全稱:Weitron Technology 功能描述:Surface Mount Switching Diode |
| MMBD2004C | 制造商:WEITRON 制造商全稱:Weitron Technology 功能描述:Surface Mount Switching Diode |
| MMBD2004S | 功能描述:DIODE SWITCH 240V 350MW SOT23-3 RoHS:否 類別:分離式半導體產品 >> 二極管，整流器 - 陣列 系列:- 其它有關文件:STTH10LCD06C View All Specifications 標準包裝:1,000 系列:- 電壓 - 在 If 時為正向 (Vf)（最大）:2V @ 5A 電流 - 在 Vr 時反向漏電:1µA @ 600V 電流 - 平均整流 (Io)（每個二極管）:5A 電壓 - (Vr)（最大）:600V 反向恢復時間(trr):50ns 二極管類型:標準 速度:快速恢復 = 200mA（Io） 二極管配置:1 對共陰極 安裝類型:表面貼裝 封裝/外殼:TO-263-3，D²Pak（2 引線+接片），TO-263AB 供應商設備封裝:D2PAK 包裝:帶卷 (TR) 產品目錄頁面:1553 (CN2011-ZH PDF) 其它名稱:497-10107-2 |
| MMBD2004S_08 | 制造商:DIODES 制造商全稱:Diodes Incorporated 功能描述:HIGH VOLTAGE SURFACE MOUNT SWITCHING DIODE |
發(fā)布緊急采購，3分鐘左右您將得到回復。