參數(shù)資料
型號: MMA1213D
廠商: MOTOROLA INC
元件分類: 模擬信號調(diào)理
英文描述: Surface Mount Micromachined Accelerometer
中文描述: SPECIALTY ANALOG CIRCUIT, PDSO16
封裝: SOIC-16
文件頁數(shù): 7/8頁
文件大?。?/td> 377K
代理商: MMA1213D
Motorola Sensor Device Data
MMA1213D
7
PACKAGE DIMENSIONS
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct footprint,
the packages will self-align when subjected to a solder reflow
process. It is always recommended to design boards with a
solder mask layer to avoid bridging and shorting between solder
pads.
Figure 6. Footprint SOIC-16 (Case 475-01)
C
K
SEATING
T
0.1
CASE 475-01
ISSUE B
1
8
16
9
P
2 PLACES, 16 TIPS
0.15
D
16X
A
B
T
A
M
0.13
B
T
A
B
A
B
G
G/2
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS "A" AND "B" DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
4. DIMENSION "D" DOES NOT INCLUDE DAMBAR
PROTRUSION. PROTRUSIONS SHALL NOT
CAUSE THE LEAD WIDTH TO EXCEED 0.75
DIM
A
B
C
D
F
G
J
K
M
P
R
MIN
10.15
7.40
3.30
0.35
0.76
1.27 BSC
0.25
0.10
0
10.16
0.25
MAX
10.45
7.60
3.55
0.49
1.14
MILLIMETERS
0.32
0.25
7
10.67
0.75
R
X 45
J
F
M
CASE 475-01
ISSUE B
0.380 in.
9.65 mm
0.050 in.
1.27 mm
0.024 in.
0.610 mm
0.080 in.
2.03 mm
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.
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