參數(shù)資料
型號: MMA1210D
廠商: 飛思卡爾半導(dǎo)體(中國)有限公司
英文描述: Surface Mount Micromachined Accelerometer(表面安裝微電機加速計)
中文描述: 表面貼裝微加速度計(表面安裝微電機加速計)
文件頁數(shù): 7/8頁
文件大?。?/td> 155K
代理商: MMA1210D
Motorola Sensor Device Data
MMA1210D
7
PACKAGE DIMENSIONS
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must
be the correct size to ensure proper solder connection
interface between the board and the package. With the
correct footprint, the packages will self-align when subjected
to a solder reflow process. It is always recommended to
design boards with a
solder mask layer to avoid bridging and shorting
between solder pads.
Figure 6. Footprint SOIC-16 (Case 475-01)
DATE 05/17/01
CASE 475-01
ISSUE B
16 LEAD SOIC
C
K
SEATING
T
0.1
1
8
16
9
P
2 PLACES, 16 TIPS
0.15
D
0.13
16X
A
B
T
A
M
B
T
A
B
A
B
G
G/2
MILLIMETERS
MIN
10.15
7.40
3.30
0.35
0.76
1.27 BSC
DIM
A
B
C
D
F
G
J
K
M
P
R
0.25
0.10
0
10.16
0.25
MAX
10.45
7.60
3.55
0.49
1.14
0.32
0.25
7
10.67
0.75
R
X 45
J
F
M
NOTES:
1.
2.
3.
4.
ALL DIMENSIONS ARE IN MILLIMETERS.
INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
DIMENSIONS "A" AND "B" DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
PER SIDE.
DIMENSION "D" DOES NOT INCLUDE DAMBAR
PROTRUSION. PROTRUSIONS SHALL NOT
CAUSE THE LEAD WIDTH TO EXCEED 0.75.
0.380 in.
9.65 mm
0.050 in.
1.27 mm
0.024 in.
0.610 mm
0.080 in.
2.03 mm
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
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