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參數(shù)資料
| 型號： | MM908E624AYEWR2 |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 29/39頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC TRPL SWITCH MCU/LIN 54-SOIC |
| 標(biāo)準(zhǔn)包裝： | 1,000 |
| 應(yīng)用： | 自動鏡像控制 |
| 核心處理器： | HC08 |
| 程序存儲器類型： | 閃存（16 kB） |
| 控制器系列： | 908E |
| RAM 容量： | 512 x 8 |
| 接口： | SCI，SPI |
| 輸入/輸出數(shù)： | 16 |
| 電源電壓： | 5.5 V ~ 18 V |
| 工作溫度： | -40°C ~ 125°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 54-BSSOP（0.295"，7.50mm 寬） |
| 包裝： | 帶卷 (TR) |
| 供應(yīng)商設(shè)備封裝： | 54-SOIC |
| 配用： | KIT908E624DWBEVB-ND - KIT EVAL 908E624 TRPL W/MCU/LIN |
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Analog Integrated Circuit Device Data
Freescale Semiconductor
35
908E624
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 3.0)
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 3.0)
INTRODUCTION
This thermal addendum is provided as a supplement to the MM908E624
technical datasheet. The addendum provides thermal performance information
that may be critical in the design and development of system applications. All
electrical, application, and packaging information is provided in the datasheet.
Packaging and Thermal Considerations
The MM908E624 is a dual die package. There are two heat sources in the
package independently heating with P1 and P2. This results in two junction
temperatures, TJ1 and TJ2, and a thermal resistance matrix with RθJAmn.
For m, n = 1, RθJA11 is the thermal resistance from Junction 1 to the reference
temperature while only heat source 1 is heating with P1.
For m = 1, n = 2, RθJA12 is the thermal resistance from Junction 1 to the
reference temperature while heat source 2 is heating with P2. This applies to
RθJ21 and RθJ22, respectively.
The stated values are solely for a thermal performance comparison of one
package to another in a standardized environment. This methodology is not meant to and will not predict the performance of a
package in an application-specific environment. Stated values were obtained by measurement and simulation according to the
standards listed below
54-Pin
SOICW
908E624
EW (Pb-FREE) SUFFIX
98ASA99294D
54-Pin SOICW
Note
For package dimensions, refer to
98ASA99294D.
TJ1
TJ2
=
RθJA11
RθJA21
RθJA12
RθJA22
.
P1
P2
Table 16. Thermal Performance Comparison
Thermal
Resistance
1 = Power Chip, 2 = Logic Chip [
°C/W]
m = 1,
n = 1
m = 1, n = 2
m = 2, n = 1
m = 2,
n = 2
RθJAmn
40
31
36
RθJBmn
25
16
21
RθJAmn
57
47
52
RθJCmn
21
12
16
Notes:
1.
Per JEDEC JESD51-2 at natural convection, still air
condition.
2.
2s2p thermal test board per JEDEC JESD51-7and
JESD51-5.
3.
Per JEDEC JESD51-8, with the board temperature on the
center trace near the power outputs.
4.
Single layer thermal test board per JEDEC JESD51-3 and
JESD51-5.
5.
Thermal resistance between the die junction and the
exposed pad, “infinite” heat sink attached to exposed pad.
54 Terminal SOIC
0.65 mm Pitch
17.9 mm x 7.5 mm Body
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| MM908E624AYPEW | 功能描述:8位微控制器 -MCU 3 HIGH SIDE SWITCH RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
| MM908E624AYPEWR2 | 功能描述:8位微控制器 -MCU 3 HIGH SIDE DRIVER RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
| MM908E625 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Quad Half H-Bridge with Power Supply, Embedded MCU, and LIN Serial Communication |
| MM908E625ACDWB | 功能描述:8位微控制器 -MCU 32 Bit 8MHz RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
| MM908E625ACDWB/R2 | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:Integrated Quad Half H-Bridge with Power Supply, Embedded MCU, and LIN Serial Communication |
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