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參數(shù)資料
| 型號： | MM908E624 |
| 廠商： | 飛思卡爾半導(dǎo)體(中國)有限公司 |
| 英文描述： | Integrated Triple High-Side Switch with Embedded MCU and LIN Serial Communication for Relay Drivers(集成三高端開關(guān)，帶嵌入式MCU和LIN串行通信功能，用于繼電器驅(qū)動器) |
| 中文描述： | 綜合三高側(cè)嵌入式微控制器和繼電器驅(qū)動器林串行通信（集成三高端開關(guān)，帶嵌入式微控制器和林串行通信功能，用于繼電器驅(qū)動器開關(guān)） |
| 文件頁數(shù)： | 23/24頁 |
| 文件大小： | 718K |
| 代理商： | MM908E624 |
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
908E624
23
PACKAGE DIMENSIONS
NOTES:
1.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
DATUMS B AND C TO BE DETERMINED AT THE PLANE
WHERE THE BOTTOM OF THE LEADS EXIT THE
PLASTIC BODY.
THIS DIMENSION DOES NOT INCLUDE MOLD FLASH,
PROTRUSION OR GATE BURRS. MOLD FLASH,
PROTRUSION OR GATE BURRS SHALL NOT EXCEED
0.15 MM PER SIDE. THIS DIMENSION IS DETERMINED
AT THE PLANE WHERE THE BOTTOM OF THE LEADS
EXIT THE PLASTIC BODY.
THIS DIMENSION DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSIONS. INTERLEAD FLASH AND
PROTRUSIONS SHALL NOT EXCEED 0.25 MM PER
SIDE. THIS DIMENSION IS DETERMINED AT THE
PLANE WHERE THE BOTTOM OF THE LEADS EXIT THE
PLASTIC BODY.
THIS DIMENSION DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED 0.46
MM. DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN
PROTRUSION AND ADJACENT LEAD SHALL NOT LESS
THAN 0.07 MM.
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
THESE DIMENSIONS APPLY TO THE FLAT SECTION
OF THE LEAD BETWEEN 0.1 MM AND 0.3 MM FROM
THE LEAD TIP.
THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM. THIS DIMENSION IS
DETERMINED AT THE OUTERMOST EXTREMES OF
THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE
BAR BURRS, GATE BURRS AND INTER-LEAD FLASH,
BUT INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
3.
4.
5.
6.
7.
8.
9.
C
17.8
7.4
1
27
28
54
0.10
A
2.35
SEATING
0.9
0.5
SECTION B-B
0.65
R0.08 MIN
B
A
(0.29)
0.38
0.22
0.30
0.25
(0.25)
PLATING
BASE METAL
ROTATED 90 CLOCKWISE
8
9
5
0.13
M
C
A B
6
A
C
7.6
18.0
9
4
10.3
5.15
A
54X
52X
2.65
0.3
A
2X 27 TIPS
B
C
B
B
0.29
0.13
0
°
8
°
0
°
0.25
GAUGE PLANE
MIN
PIN 1 INDEX
DWB SUFFIX
54-TERMINAL SOIC WIDE BODY
PLASTIC PACKAGE
CASE 1365-01
ISSUE O
F
Freescale Semiconductor, Inc.
Go to: www.freescale.com
n
.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MM908E624ACDWB | 功能描述:IC TRPL SWITCH MCU/LIN 54-SOIC RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器 - 特定應(yīng)用 系列:- 產(chǎn)品變化通告:Product Discontinuation 26/Aug/2009 標(biāo)準(zhǔn)包裝:250 系列:- 應(yīng)用:網(wǎng)絡(luò)處理器 核心處理器:4Kc 程序存儲器類型:- 控制器系列:- RAM 容量:16K x 8 接口:以太網(wǎng)，UART，USB 輸入/輸出數(shù):- 電源電壓:1.8V, 3.3V 工作溫度:- 安裝類型:表面貼裝 封裝/外殼:208-LQFP 包裝:帶卷 (TR) 供應(yīng)商設(shè)備封裝:PG-LQFP-208 其它名稱:SP000314382 |
| MM908E624ACDWB/R | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:TRIPLE HIGH-SIDE SWITCH WITH EMBEDDED MCU AND LIN |
| MM908E624ACDWB/R2 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Triple High Side Switch with Embedded MCU and LIN Serial Communicationfor Relay Drivers |
| MM908E624ACDWBR2 | 功能描述:IC TRPL SWITCH MCU/LIN 54-SOIC RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器 - 特定應(yīng)用 系列:- 產(chǎn)品變化通告:Product Discontinuation 26/Aug/2009 標(biāo)準(zhǔn)包裝:250 系列:- 應(yīng)用:網(wǎng)絡(luò)處理器 核心處理器:4Kc 程序存儲器類型:- 控制器系列:- RAM 容量:16K x 8 接口:以太網(wǎng)，UART，USB 輸入/輸出數(shù):- 電源電壓:1.8V, 3.3V 工作溫度:- 安裝類型:表面貼裝 封裝/外殼:208-LQFP 包裝:帶卷 (TR) 供應(yīng)商設(shè)備封裝:PG-LQFP-208 其它名稱:SP000314382 |
| MM908E624ACEW | 功能描述:開關(guān) IC - 各種 TRIPLE HIGH SIDE SW RoHS:否 制造商:Fairchild Semiconductor 開啟電阻（最大值）: 電源電壓-最大:4.4 V 電源電壓-最小:2.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:WLCSP-9 封裝:Reel |
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