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參數(shù)資料
| 型號(hào)： | MLX90242LVA-CC03 |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | Linear Hall Effect Sensor |
| 中文描述： | 線(xiàn)性霍爾效應(yīng)傳感器 |
| 文件頁(yè)數(shù)： | 5/7頁(yè) |
| 文件大?。?/td> | 166K |
| 代理商： | MLX90242LVA-CC03 |
MLX90242
Linear Hall Effect Sensor
3901090242
Rev. 024
Page 5 of 7
Data Sheet
Mar/04
7. Applications Information
C1 and C2 values can be trimmed to satisfied
EMC requirements according to the environment
(PCB, connectors,...).
The output rise time is affected for large
capacitor C2, depending of the couple R1;C2.
8. Installation Comments
1.) Avoid mechanical stress on leads or
package.
Stress may cause V
OQ
shift.
A.) Avoid bending leads at the package interface.
B.) Support the leads by clamping, when bending.
C.) Avoid gluing device to another material.
This may cause temperature-related stress.
2.) CMOS products are static sensitive devices,
please observe ESD precautions.
3.) Observe temperature limits during soldering
Recommended Wiring
C1 = 10nF
C2 = 2.5nF
MLX
90242
1
2
3
V
OUT
V
DD
R1 = 10 k
9. Reliability Information
Melexis devices are classified and qualified regarding suitability for infrared, vapor phase and wave
soldering with usual (63/37 SnPb-) solder (melting point at 183degC).
The following test methods are applied:
IPC/JEDEC J-STD-020A (issue April 1999)
Moisture/Reflow Sensitivity Classification For Nonhermetic Solid State Surface Mount Devices
CECC00802 (issue 1994)
Standard Method For The Specification of Surface Mounting Components (SMDs) of Assessed Quality
MIL 883 Method 2003 / JEDEC-STD-22 Test Method B102
Solderability
For all soldering technologies deviating from above mentioned standard conditions (regarding peak
temperature, temperature gradient, temperature profile etc) additional classification and qualification tests
have to be agreed upon with Melexis. For process using through hole components, a temperature profile
of 235 Deg.C during 30 seconds maximum is tolerated.
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance
of adhesive strength between device and board. Please contact MLX for Ua part used as SMD device.
For more information on manufacturability/solderability see quality page at our website:
http://www.melexis.com/
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