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參數(shù)資料
| 型號： | MLG0603Q3N1ST |
| 元件分類： | 通用定值電感 |
| 英文描述： | 1 ELEMENT, 0.0031 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD |
| 封裝： | CHIP, 0603, ROHS COMPLIANT |
| 文件頁數(shù)： | 1/5頁 |
| 文件大小： | 75K |
| 代理商： | MLG0603Q3N1ST |
(1/5)
005-05 / 20101015 / e521_mlg0603q.fm
All specifications are subject to change without notice.
SMD Inductors(Coils)
For High Frequency(Multilayer)
MLG Series MLG0603Q Type
This product will be removed from the catalog at the end of March, 2011. Please consider our new MLG0603P series of products with equivalent
characteristics.
FEATURES
It serializes a product of inductance 0.2 to100nH. In a product of
0.2 to 4.0nH, it realizes line up in a 0.1nH steps.
By the most suitable design, Q is higher than competing in a
conventional product MLG0603S type. In particular, Q in more
than 800MHz largely improved.
Advanced monolithic structure is formed using a multilayering
and sintering process with ceramic and conductive materials for
high-frequency.
The products contain no lead and also support lead-free
soldering.
It is a product conforming to RoHS directive.
APPLICATIONS
For high-frequency applications including mobile phones, high
frequency modules (PA, VCO, FEM etc.), Bluetooth, W-LAN, UWB
and tuners.
SHAPES AND DIMENSIONS
RECOMMENDED PC BOARD PATTERN
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
PRODUCT IDENTIFICATION
(1) Series name
(2) Dimensions
(3) Material code
(4) Inductance value
(5) Inductance tolerance
(6) Packaging style
SPECIFICATIONS
PACKAGING STYLE AND QUANTITIES
HANDLING AND PRECAUTIONS
Before soldering, be sure to preheat components.
The preheating temperature should be set so that the
temperature difference between the solder temperature and
product temperature does not exceed 150°C.
After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
When hand soldering, apply the soldering iron to the printed
circuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
Conformity to RoHS Directive
0.6±0.03
0.06±0.04
0.15±0.05
0.3±
0.03
0.3±
0.03
Weight: 0.2mg
Dimensions in mm
0.3
0.25
0.3
Natural
cooling
10s max.
Preheating
60 to 120s
Soldering
30 to 60s
230C
250 to 260C
180C
150C
Time(s)
0603
0.6
×0.3mm (L×W)
2N2
2.2nH
12N
12nH
B
±0.1nH
C
±0.2nH
S
±0.3nH
H±3%
J±5%
T
Taping (reel)
Operating temperature range
–55 to +125°C
Storage temperature range
–55 to +125°C
Packaging style
Quantity
Taping
15000 pieces/reel
MLG 0603 Q 2N2
S
T
(1)
(2)
(3)
(4)
(5) (6)
Please contact our Sales office when your application are considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MLG0603Q3N2 | 制造商:TDK 制造商全稱:TDK Electronics 功能描述:SMD Inductors(Coils) For High Frequency(Multilayer) |
| MLG0603Q3N2S | 功能描述:固定電感器 3.2nH RoHS:否 制造商:AVX 電感:10 uH 容差:20 % 最大直流電流:1 A 最大直流電阻:0.075 Ohms 工作溫度范圍:- 40 C to + 85 C 自諧振頻率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接類型:SMD/SMT 封裝 / 箱體:6.6 mm x 4.45 mm |
| MLG0603Q3N3 | 制造商:TDK 制造商全稱:TDK Electronics 功能描述:SMD Inductors(Coils) For High Frequency(Multilayer) |
| MLG0603Q3N3S | 功能描述:固定電感器 3.3nH RoHS:否 制造商:AVX 電感:10 uH 容差:20 % 最大直流電流:1 A 最大直流電阻:0.075 Ohms 工作溫度范圍:- 40 C to + 85 C 自諧振頻率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接類型:SMD/SMT 封裝 / 箱體:6.6 mm x 4.45 mm |
| MLG0603Q3N3ST | 功能描述:固定電感器 0201 3.3nH 0.3nH RoHS:否 制造商:AVX 電感:10 uH 容差:20 % 最大直流電流:1 A 最大直流電阻:0.075 Ohms 工作溫度范圍:- 40 C to + 85 C 自諧振頻率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接類型:SMD/SMT 封裝 / 箱體:6.6 mm x 4.45 mm |
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