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參數(shù)資料
| 型號： | MLF2012DR27XT |
| 廠商： | TDK Corporation |
| 英文描述： | SMD |
| 中文描述： | 貼片 |
| 文件頁數(shù)： | 1/3頁 |
| 文件大小： | 102K |
| 代理商： | MLF2012DR27XT |
All specifications are subject to change without notice.
Specifications which provide more details for the proper and safe use of the described product are available upon request.
Inductors
For General Applications
SMD
MLF Series MLF2012 Type
FEATURES
High-reliability monolithic structure.
Ferrite core and magnetic shielding enables the design of com-
pact circuits with high packing density.
Excellent solderability and high heat resistance permits either
flow or reflow soldering.
APPLICATIONS
Personal computers, HDDs, or other various electronic appliances.
SPECIFICATIONS
RECOMMENDED REFLOW SOLDERING CONDITIONS
PRODUCT IDENTIFICATION
MLF 1608
A 1R0 K
(1)
(2) (3) (4) (5) (6)
(1) Series name
(2) Dimensions L
1608
2012
×
W
(3) Material code
(4) Inductance value
47N
R15
1R0
100
(5) Inductance tolerance
K
M
(6) Packaging style
T
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
HANDLING AND PRECAUTIONS
Before soldering, be sure to preheat components.
The preheating temperature should be set so that the tempera-
ture difference between the solder temperature and product
temperature does not exceed 150°C.
After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
The inductance value may change due to magnetic saturation if
the current exceeds the rated maximum.
Do not expose the inductors to stray magnetic fields.
Avoid static electricity discharge during handling.
When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
300°C. Soldering time should not exceed 3 seconds.
Operating temperature range
Storage temperature range
–25 to +85°C
–40 to +85°C[Unit of products]
10s max.
40s max.
Preheating 60 to 120s min.
Natural
cooling
220°C
200°C
150°C
Time(s)
1.6
2.0
×
×
0.8mm
1.25mm
47nH[0.047
0.15
μ
H
1
μ
H
10
μ
H
μ
H]
±10%
±20%
Taping [reel]
Product’s thickness
0.8/0.85mm
1.25mm
Quantity
4000 pieces/reel
2000 pieces/reel
T
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MLF2012DR33J | 功能描述:固定電感器 2012 0.33uH 5% RoHS:否 制造商:AVX 電感:10 uH 容差:20 % 最大直流電流:1 A 最大直流電阻:0.075 Ohms 工作溫度范圍:- 40 C to + 85 C 自諧振頻率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接類型:SMD/SMT 封裝 / 箱體:6.6 mm x 4.45 mm |
| MLF2012DR33JT | 制造商:TDK CORPORATION OF AMERICA 功能描述:Ind General Purpose Chip Shielded Multi-Layer 330nH 5% 25MHz 20Q-Factor Ferrite 250mA 0805 T/R |
| MLF2012DR33JTD25 | 功能描述:330nH Shielded Multilayer Inductor 250mA 400 mOhm Max 0805 (2012 Metric) 制造商:tdk corporation 系列:MLF 包裝:剪切帶（CT） 零件狀態(tài):有效 類型:多層 材料 - 磁芯:鐵氧體 電感:330nH 容差:±5% 額定電流:250mA 電流 - 飽和值:- 屏蔽:屏蔽 DC 電阻（DCR）:400 毫歐最大 不同頻率時的 Q 值:20 @ 25MHz 頻率 - 自諧振:200MHz 等級:AEC-Q200 工作溫度:-55°C ~ 125°C 頻率 - 測試:25MHz 安裝類型:表面貼裝 封裝/外殼:0805（2012 公制） 大小/尺寸:0.079" 長 x 0.049" 寬（2.00mm x 1.25mm） 高度 - 安裝（最大值）:0.041"（1.05mm） 標(biāo)準(zhǔn)包裝:1 |
| MLF2012DR33K | 功能描述:固定電感器 0805 0.33uH 10% RoHS:否 制造商:AVX 電感:10 uH 容差:20 % 最大直流電流:1 A 最大直流電阻:0.075 Ohms 工作溫度范圍:- 40 C to + 85 C 自諧振頻率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接類型:SMD/SMT 封裝 / 箱體:6.6 mm x 4.45 mm |
| MLF2012DR33KT | 制造商:TDK Epcos 功能描述: |
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