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參數(shù)資料
| 型號(hào)： | ML401-G |
| 英文描述： | 1.7-2.2 GHz High IP3 Mixer with Integrated LO Amp |
| 中文描述： | 1.7-2.2 GHz的高IP3混頻器，集成LO放大器 |
| 文件頁(yè)數(shù)： | 4/4頁(yè) |
| 文件大?。?/td> | 308K |
| 代理商： | ML401-G |
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
Page 4 of 4 June 2006
ML401
1.7–2.2 GHz High IP3 Mixer with Integrated LO Amp
Product Information
The Communications Edge
TM
ML401-G Mechanical Information
This package is lead-free/green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free
(maximum 260
°
C reflow temperature) and lead (maximum 245
°
C reflow temperature) soldering processes.
Outline Drawing
Mounting Configuration / Land Pattern
1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill
and have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the
heatsink.
4. All dimensions are in millimeters (inches). Angles are in degrees.
5. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink.
6. RF trace width depends upon the PC board material and construction.
7. Use 1 oz. Copper minimum.
Thermal Specifications
Parameter
Rating
Operating Case Temperature
-40 to +85
°
C
Thermal Resistance, Rth
104
°
C / W
Product Marking
The component will be lasermarked with a
“ML401-G”
product
alphanumeric lot code on the top surface of the
package.
Tape and reel specifications for this part will be
located on the website in the “Application
Notes” section.
ESD / MSL Information
label
with
an
ESD Rating: Class 1B
Value:
Test:
Standard:
ESD Rating: Class IV
Value:
Test:
Standard:
MSL Rating: Level 2 at +260
°
C convection reflow
Standard:
JEDEC Standard J-STD-020
Functional Pin Layout
Passes
Human Body Model (HBM)
JEDEC Standard JESD22-A114
500V to <1000V
Passes
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
1000V
Pin
1
2
3
4
5
6
7
8
Function
LO
GND
Vcc1
Vcc2
IF
GND
GND
RF
Backside paddle is RF and DC ground.
1
2
3
4
8
7
6
5
RF
IF
GND
LO
GND
Vcc1
Vcc2
GND
The backside paddle is Ground.
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