
O V E R V I E W
Phone: 949-450-8700
Fax: 949-450-8710
E-mail: info@broadcom.com
Web: www.broadcom.com
BROADCOM CORPORATION
16215 Alton Parkway, P.O. Box 57013
Irvine, California 92619-7013
2003 by BROADCOM CORPORATION. All rights reserved.
ML2011-PB02-R
11/18/03
Broadcom
, the pulse logo, and
Connecting everything
are trademarks of Broadcom Corporation and/
or its subsidiaries in the United States and certain other countries. All other trademarks mentioned are the
property of their respective owners.
The
ML2011
GSM baseband processor offers a high
level of system
integration, performance, and features for next-generation handsets and
radio cards. The
ML2011
is a single-chip baseband device that is
applicable for wireless handsets and speakerphones.
The integration of the PA controller and speaker/car phone audio
circuitry adds key GSM handset features while reducing overall system
cost.
The
ML2011
contains all of the analog and digital GSM baseband
processing functions on a single silicon substrate. Interface functions and
drivers are integrated to enable auxiliary components, such as
microphone, speaker, displays, keypad, data terminal equipment, and
SIM to connect directly to the chip. A flexible baseband control interface
supports a wide range of transceivers, including GSM850, E-GSM900,
GSM1800, and GSM1900 frequency bands.
To accelerate our customer's product development cycle and to enable
high-volume manufacturing, Broadcom also offers handset system
solutions, including:
Complete handset and modem software, evaluation boards, reference
designs, and extensive integration support
GSM Certification Forum (GCF) and interoperability testing (IOT)
Worldwide network field testing
To further reduce overall component count and BOM cost, the
ML2011
integrates a number of typical PCB circuits, such as a PA controller, echo
cancellation chip, noise suppression chip, and hands-free answer
sensing.
Features such as the peripheral serial bus interface, integrated 1.8V/3V
SIM, and multiplexed I&Q channels add flexibility when connecting to
other onboard components.
The result is a dramatic reduction in the total system IC count, footprint,
cost, and power consumption. The high level of integration also
simplifies the handset manufacturing process and enhances reliability
because there are fewer system components.
The ARM7TDMI processor runs the high-level application software,
such as the SATK, WAP browser, voice recognition/recording, and user
interface. The processor can interface to various polyphonic ringer chips
and can control two black and white or color LCD panels for high-end
handsets.
The Oak DSP performs the GSM physical layer functions including
voice and baseband codecs, speech coding, channel coding and
interleaving, and RF interface transceiver control. To minimize power
consumption, the Oak DSP uses hardware coprocessors for computation-
intensive processing functions. Echo cancellation and noise suppression
software is also included on the DSP to target speakerphone and other
noisy environments.
ML2011
LCD
SIM Card
RAM
ROM
MMI
Drivers
and
Interface
Timers
PLL
Voiceband CODEC
ADC
DAC
Baseband CODEC
Mod.
DAC
ADC
Auxiliary
Functions
ADC
13 MHz
Battery
AFC
Digital RF
Control
MUX
XTAL
Mod.
VCO
PA
Transceiver
PA Control
Flash
SRAM
PC/DTE
LEDs
Hands-
Free
Keypad
L
N
A
x
D
Down
External
Memory
Interface
ARM7TDMI
RISC
- IrDA
- UARTs
- Ringing
- Charging
- User interface
- WAP
- SATK
- Services
- Protocols
- Voice dialing
- Voice recording
Hardware
Coprocessors
Oak DSP
- Speakerphone
- Signal processing
- Speech algorithm
DAC