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參數(shù)資料
| 型號(hào)： | MICRF610TR |
| 廠商： | MICREL INC |
| 元件分類： | 通信及網(wǎng)絡(luò) |
| 英文描述： | 868-870 MHz ISM Band Transceiver Module |
| 中文描述： | SPECIALTY TELECOM CIRCUIT, QMA16 |
| 封裝： | 11.50 X 14.10 MM, MODULE-16 |
| 文件頁數(shù)： | 10/20頁 |
| 文件大?。?/td> | 698K |
| 代理商： | MICRF610TR |
Micrel, Inc.
MICRF610/MICRF610Z
July 2006
18
M9999-120205
Application Circuit Illustration
Figure 11. Circuit illustration of MICRF610, LDO and MCU
Figure 11 shows a typical set-up with the MICRF610, a
Low-Drop-Out voltage regulator (LDO)
and a mikro-
controller (MCU). When the MICRF610 and the MCU runs
on the same power supply (min 2.0, max. 2.5V), the IO
can be connected directly to the MCU. If the MCU needs a
higher VDD than the max. specified VDD of the MICRF610
(2.5V), voltage dividers need to be added on the IO lines
not to override the max. input voltage.
Figure 12 shows a recommended voltage divider circuit for
a MCU running at 3.0V and the MICRF610 at 2.5V.
3k3
18k
3k3
18k
3k3
18k
15k
MICRF6xx
MCU
CS
SCLK
IO
DATAIXO
DATACLK
LD
RSSI
CS
SCLK
IO
DATAIXO
DATACLK
LD
RSSI
Figure 12. How to connect MICRF610 (2.5V) and MCU (3.0V)
Assembling the MICRF610
Recommended Reflow Temperature Profile
When the MICRF610 module is being automatically
assembled to a PCB, care must be taken not to expose
the module for temperature above the maximum specified.
Figure 13 shows the recommended reflow temperature
profile.
Figure 13. Recommended Reflow Temperature Reflow
Shock/Vibration during Reflow
The module has several components inside which are
assembled in a reflow process. These components may
reflow again when the module is assembled onto a PCB. It
is therefore important that the module is not subjected to
any mechanical shock or vibration during this process.
Handassembling the MICRF610
It is recommended to use solder paste also during hand
assembling of the module. Because of the module ground
pad on the bottom side, the module will be assembled
most efficient if the heat is being subjected to the bottom
side of the PCB. The heat will be transferred trough the
PCB due the ground vias under the module (see Layout
Considerations). In addition, it is recommended to use a
solder tip on the signal and power pads, to make sure the
solder points are properly melted.
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| MICRF610 | 868-870 MHz ISM Band Transceiver Module |
| MIK0-55S | 55 CONTACT(S), POLYETHYLENE, FEMALE, CIRCULAR CONNECTOR, CRIMP, RECEPTACLE |
| MIK0-7S | 7 CONTACT(S), POLYETHYLENE, FEMALE, CIRCULAR CONNECTOR, CRIMP, RECEPTACLE |
| MIK6-55P | 55 CONTACT(S), POLYETHYLENE, MALE, CIRCULAR CONNECTOR, CRIMP, PLUG |
| MIK6-7P | 7 CONTACT(S), POLYETHYLENE, MALE, CIRCULAR CONNECTOR, CRIMP, PLUG |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MICRF610Z | 功能描述:IC RF MOD 868-870MHZ 11.5X14.1MM RoHS:是 類別:RF/IF 和 RFID >> RF 收發(fā)器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:30 系列:- 頻率:4.9GHz ~ 5.9GHz 數(shù)據(jù)傳輸率 - 最大:54Mbps 調(diào)制或協(xié)議:* 應(yīng)用:* 功率 - 輸出:-3dBm 靈敏度:- 電源電壓:2.7 V ~ 3.6 V 電流 - 接收:* 電流 - 傳輸:* 數(shù)據(jù)接口:PCB，表面貼裝 存儲(chǔ)容量:- 天線連接器:PCB，表面貼裝 工作溫度:-25°C ~ 85°C 封裝/外殼:68-TQFN 裸露焊盤 包裝:管件 |
| MICRF610Z TR | 功能描述:IC RF MOD 868-870MHZ 11.5X14.1MM RoHS:是 類別:RF/IF 和 RFID >> RF 收發(fā)器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:30 系列:- 頻率:4.9GHz ~ 5.9GHz 數(shù)據(jù)傳輸率 - 最大:54Mbps 調(diào)制或協(xié)議:* 應(yīng)用:* 功率 - 輸出:-3dBm 靈敏度:- 電源電壓:2.7 V ~ 3.6 V 電流 - 接收:* 電流 - 傳輸:* 數(shù)據(jù)接口:PCB，表面貼裝 存儲(chǔ)容量:- 天線連接器:PCB，表面貼裝 工作溫度:-25°C ~ 85°C 封裝/外殼:68-TQFN 裸露焊盤 包裝:管件 |
| MICRF620 | 制造商:MICREL 制造商全稱:Micrel Semiconductor 功能描述:434MHz ISM Band Transceiver Module |
| MICRF620_0608 | 制造商:MICREL 制造商全稱:Micrel Semiconductor 功能描述:434MHz ISM Band Transceiver Module |
| MICRF620DEV1 | 制造商:Micrel Inc 功能描述:DEVELOPMENT KIT TRANSCEIVER 433MHZ |
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