參數(shù)資料
型號(hào): MIC7111
廠商: Micrel Semiconductor,Inc.
英文描述: 40000 SYSTEM GATE 3.3 VOLT LOGIC CELL AR - NOT RECOMMENDED for NEW DESIGN
中文描述: 1.8 IttyBitty⑩軌到軌輸入/輸出運(yùn)算放大器的初步信息
文件頁(yè)數(shù): 5/8頁(yè)
文件大?。?/td> 73K
代理商: MIC7111
June 1998
5
MIC7111
MIC7111
Micrel
Symbol
Parameter
Condition
Min
Typ
Max
Units
I
B
Input Bias Current
1
10
500
pA
pA
I
OS
Input Offset Current
0.01
0.5
75
pA
pA
R
IN
+PSRR
Input Resistance
>10
T
Positive Power Supply
Rejection Ratio
5V
V
V+
10V, V
V–
= 0V,
V
CM
= V
OUT
= 2.5V
–5V
V
V–
–10V, V
V+
= 0V,
V
CM
= V
OUT
= –2.5V
V
CM
= –0.2V to +10.2V
65
95
dB
–PSRR
Negative Power Supply
Rejection Ratio
65
95
dB
CMRR
Common-Mode Rejection Ratio
60
85
dB
C
IN
V
OUT
Common Mode Input Capacitance
3
pF
Output Voltage Swing
output high, R
L
= 100k,
specified as V
V+
– V
OUT
output low, R
L
= 100k
0.45
2.5
2.5
mV
mV
0.45
2.5
2.5
mV
mV
output high, R
L
= 2k,
specified as V
V+
– V
OUT
output low, R
L
= 2k
24
80
120
mV
mV
24
80
120
mV
mV
I
SC
Output Short Circuit Current
Note 6
sourcing, V
OUT
= 0V
sinking, V
OUT
= 10V
sourcing
100
200
mA
100
200
mA
A
VOL
Voltage Gain
500
V/mV
sinking
500
V/mV
I
S
AC Electrical Characteristics (10V)
V+ = +10V, V– = 0V, V
CM
= V
OUT
= V
V+
/2; R
L
= 1M; T
J
= 25
°
C,
bold
values indicate –40
°
C
T
J
+85
°
C; unless noted
Symbol
Parameter
Condition
Supply Current
V
V+
= 10V, V
OUT
= V
V+
/2
25
65
μ
A
Min
Typ
Max
Units
SR
Slew Rate
voltage follower, 1V step, R
L
= 100k@1.35V
V
OUT
= 1V
P–P
0.02
V/
μ
s
GBW
Gain Bandwidth Product
25
kHz
φ
M
G
M
Phase Margin
50
°
Gain Margin
15
dB
e
N
Input Referred Voltage Noise
f = 1kHz, V
CM
= 1.0V
110
nV/ Hz
i
N
Input Referred Current Noise
f = 1kHz
0.03
pA/ Hz
General Notes:
Devices are ESD protected; however, handling precautions are recommended. All limits guaranteed by testing on statistical analysis.
Note 1:
Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply when
operating the device outside its recommended operating ratings.
Note 2:
I/O Pin Voltage is any external voltage to which an input or output is referenced.
Note 3:
The maximum allowable power dissipation is a function of the maximum junction temperature, T
; the junction-to-ambient thermal
resistance,
θ
JA
; and the ambient temperature, T
. The maximum allowable power dissipation at any ambient temperature is calculated using:
P
D
= (T
J(max)
– T
A
)
÷
θ
JA
. Exceeding the maximum allowable power dissipation will result in excessive die temperature.
Note 4:
Thermal resistance,
θ
JA
, applies to a part soldered on a printed-circuit board.
Note 5:
Human body model, 1.5k in series with 100pF.
Note 6:
Short circuit may cause the device to exceed maxium allowable power dissipation. See
Note 3
.
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