參數(shù)資料
型號: MIC4682BM
廠商: MICREL INC
元件分類: 穩(wěn)壓器
英文描述: PRECISION CURRENT LIMIT SO-8 SUPERSWITCHER BUCK REGULATOR
中文描述: 1.1 A SWITCHING REGULATOR, 220 kHz SWITCHING FREQ-MAX, PDSO8
封裝: SOIC-8
文件頁數(shù): 11/15頁
文件大?。?/td> 226K
代理商: MIC4682BM
October 2003
11
M0334-102203
MIC4682
Thermal Considerations
The MIC4682 SuperSwitcher
features the power-SOP-8.
This package has a standard 8-lead small-outline package
profile, but with much higher power dissipation than a stan-
dard SOP-8. Micrel
s MIC4682 SuperSwitcher
family are
the first DC-to-DC converters to take full advantage of this
package.
The reason that the power SOP-8 has higher power dissipa-
tion (lower thermal resistance) is that pins 2, 6, 7 and the die-
attach paddle are a single piece of metal. The die is attached
to the paddle with thermally conductive adhesive. This pro-
vides a low thermal resistance path from the junction of the
die to the ground pins. This design significantly improves
package power dissipation by allowing excellent heat trans-
fer through the ground leads to the printed circuit board.
One limitation of the maximum output current on any MIC4682
design is the junction-to-ambient thermal resistance (
θ
JA
) of
the design (package and ground plane).
Examining
θ
JA
in more detail:
θ
JA
= (
θ
JC
+
θ
CA
)
where:
θ
JC
= junction-to-case thermal resistance
θ
CA
= case-to-ambient thermal resistance
θ
JC
is a relatively constant 20
°
C/W for a power SOP-8.
θ
CA
is dependent on layout and is primarily governed by the
connection of pins 2, 6 and 7 to the ground plane. The
purpose of the ground plane is to function as a heat sink.
θ
JA
is ideally 63
°
C/W, but will vary depending on the size of
the ground plane to which the power SOP-8 is attached.
Determining Ground-Plane Heat-Sink Area
There are two methods of determining the minimum ground
plane area required by the MIC4682.
Quick Method
Make sure that MIC4682 pins 2, 6 and 7 are connected to a
ground plane with a minimum area of 6cm
2
. This ground
plane should be as close to the MIC4682 as possible. The
area may be distributed in any shape around the package or
on any PCB layer as ong as here s good hermal contact o
Micrel
pins 2, 6 and 7 This ground plane area is more than sufficient
for most designs.
Minimum Copper/Maximum Current Method
Using Figure 3, for a given input voltage range, determine the
minimum ground-plane heat-sink area required for the
application
s maximum continuous output current. Figure 3
assumes a constant die temperature of 75
°
C above ambient.
0
0.5
1.0
1.5
0
5
10
AREA (cm
2
)
15
20
25
C
12V
8V
V
IN
= 30V
24V
T
A
= 50
°
C
Figure 3. Output Current vs. Ground Plane Area
When designing with the MIC4682, it is a good practice to
connect pins 2, 6 and 7 to the largest ground plane that is
practical for the specific design.
Checking the Maximum Junction Temperature
For this example, with an output power (P
OUT
) of 5W, (5V
output at 1A maximum with V
IN
= 12V) and 65
°
C maximum
ambient temperature, what is the maximum junction tem-
perature
Referring to the
Typical Characteristics: Efficiency vs. Out-
put Current
graph, read the efficiency (
η
) for 1A output
current at V
IN
= 12V or perform you own measurement.
η
= 81%
The efficiency is used to determine how much of the output
power (P
OUT
) is dissipated in the regulator circuit (P
D
).
P =P
P
OUT
η
OUT
P =5W
0.81
5W
P
D
= 1.17W
A worst-case rule of thumb is to assume that 80% of the total
output power dissipation is in the MIC4682 (P
D(IC)
) and 20%
is in the diode-inductor-capacitor circuit.
P
D(IC)
= 0.8 P
D
P
D(IC)
= 0.8
×
1.17W
P
D(IC)
= 0.936W
Calculate the worst-case junction temperature:
T
J
= P
D(IC)
θ
JC
+ (T
C
T
A
) + T
A(max)
where:
T
J
= MIC4682 junction temperature
P
D(IC)
= MIC4682 power dissipation
θ
JC
= junction-to-case thermal resistance.
The
θ
JC
for the MIC4682
s power-SOP-8 is approximately
20
°
C/W.
θ
JA
θ
JC
θ
CA
AMBENT
printed circuit board
ground plane
heat sink area
SOP-8
Figure 2. Power SOP-8 Cross Section
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