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參數(shù)資料
| 型號(hào)： | MIC4555YML TR |
| 廠(chǎng)商： | Micrel Inc |
| 文件頁(yè)數(shù)： | 2/15頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC SIM CARD LEVEL SHIFTER 16MLF |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 邏輯功能： | 電平移位器，雙向 |
| 位數(shù)： | 1 |
| 輸入類(lèi)型： | 電壓 |
| 輸出類(lèi)型： | 電壓 |
| 數(shù)據(jù)速率： | 5MHz |
| 通道數(shù)： | 1 |
| 輸出/通道數(shù)目： | 1 |
| 差分 - 輸入:輸出： | 無(wú)/無(wú) |
| 電源電壓： | 2.7 V ~ 5.5 V |
| 工作溫度： | -40°C ~ 125°C |
| 封裝/外殼： | 16-VFQFN 裸露焊盤(pán)，16-MLF? |
| 供應(yīng)商設(shè)備封裝： | 16-MLF?（3x3） |
| 包裝： | 標(biāo)準(zhǔn)包裝 |
| 其它名稱(chēng)： | 576-3962-6 |
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ICS8535I-31
LOW SKEW, 1-TO-4, CRYSTAL OSCILLATOR/LVCMOS-TO-3.3V LVPECL FANOUT BUFFER
ICS8535AGI-31 REVISION A JANUARY 27, 2010
10
2010 Integrated Device Technology, Inc.
Power Considerations
This section provides information on power dissipation and junction temperature for the ICS8535I-31.
Equations and example calculations are also provided.
1.
Power Dissipation.
The total power dissipation for the ICS8535I-31 is the sum of the core power plus the power plus the power dissipated in the load(s).
The following is the power dissipation for VCC = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 65mA = 225.2mW
Power (outputs)MAX = 30mW/Loaded Output Pair
If all outputs are loaded, the total power is 4 * 30mW = 120mW
Total Power_MAX (3.465V, with all outputs switching) = 225.2mW + 120mW = 345.2mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad directly affects the reliability of the device. The
maximum recommended junction temperature is 125°C. Limiting the internal transistor junction temperature, Tj, to 125°C ensures that the bond
wire and bond pad temperature remains below 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming a moderate air
flow of 200 linear feet per meter and a multi-layer board, the appropriate value is 66.6°C/W per Table 7 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.345W * 66.6°C/W = 108°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of
board (multi-layer).
Table 7. Thermal Resistance θJA for 20 Lead TSSOP, Forced Convection
θ
JA by Velocity
Linear Feet per minute
0200
500
Multi-Layer PCB, JEDEC Standard Test Boards
73.2°C/W
66.6°C/W
63.5°C/W
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