參數(shù)資料
型號(hào): MIC3775
廠商: Micrel Semiconductor,Inc.
元件分類: FPGA
英文描述: FPGA 2000000 SYSTEM GATE 1.8 VOLT - NOT RECOMMENDED for NEW DESIGN
中文描述: 七五〇毫安開普低電壓低壓差穩(wěn)壓器
文件頁數(shù): 11/14頁
文件大小: 139K
代理商: MIC3775
March 2003
11
MIC3775
MIC3775
Micrel
Adjustable Regulator Design
IN
R1
V
OUT
V
IN
C
OUT
R2
EN
OUT
ADJ
GND
MIC3775
ENABLE
SHUTDOWN
V
1.240V 1
R1
R2
OUT
=
+
Figure 2. Adjustable Regulator with Resistors
The MIC3775 allows programming the output voltage any-
where between 1.24V and the 6V maximum operating rating
of the family. Two resistors are used. Resistors can be quite
large, up to 1M
, because of the very high input impedance
and low bias current of the sense comparator. The resistor
values are calculated by:
R1 R2
V
1.240
1
OUT
Where V
O
is the desired output voltage. Figure 2 shows
component definition. Applications with widely varying load
currents may scale the resistors to draw the minimum load
current required for proper operation (see above).
Power MSOP-8 Thermal Characteristics
One of the secrets of the MIC3775
s performance is its power
MSOP-8 package featuring half the thermal resistance of a
standard MSOP-8 package. Lower thermal resistance means
more output current or higher input voltage for a given
package size.
Lower thermal resistance is achieved by joining the four
ground leads with the die attach paddle to create a single-
piece electrical and thermal conductor. This concept has
been used by MOSFET manufacturers for years, proving
very reliable and cost effective for the user.
Thermal resistance consists of two main elements,
θ
JC
(junction-to-case thermal resistance) and
θ
CA
(case-to-ambi-
ent thermal resistance). See Figure 3.
θ
JC
is the resistance
from the die to the leads of the package.
θ
CA
is the resistance
from the leads to the ambient air and it includes
θ
CS
(case-to-
sink thermal resistance) and
θ
SA
(sink-to-ambient thermal
resistance).
Using the power MSOP-8 reduces the
θ
JC
dramatically and
allows the user to reduce
θ
CA
. The total thermal resistance,
θ
JA
(junction-to-ambient thermal resistance) is the limiting
factor in calculating the maximum power dissipation capabil-
ity of the device. Typically, the power MSOP-8 has a
θ
JA
of
80
°
C/W, this is significantly lower than the standard MSOP-8
which is typically 160
°
C/W.
θ
CA
is reduced because pins 5
through 8 can now be soldered directly to a ground plane
which significantly reduces the case-to-sink thermal resis-
tance and sink-to-ambient thermal resistance.
Low-dropout linear regulators from Micrel are rated to a
maximum junction temperature of 125
°
C. It is important not
to exceed this maximum junction temperature during opera-
tion of the device. To prevent this maximum junction tempera-
ture from being exceeded, the appropriate ground plane
heatsink must be used.
θ
JA
θ
JC
θ
CA
printed circuit board
Figure 3. Thermal Resistance
ground plane
heat sink area
MSOP-8
AMBIENT
Figure 4 shows copper area versus power dissipation with
each trace corresponding to a different temperature rise
above ambient.
From these curves, the minimum area of copper necessary
for the part to operate safely can be determined. The maxi-
mum allowable temperature rise must be calculated to deter-
mine operation along which curve.
0
100
200
300
400
500
600
700
800
900
0
0.25 0.50 0.75 1.00 1.25 1.50
POWER DISSIPATION (W)
C
2
)
4
°
C
5
°
C
5
°
C
6
°
C
7
°
C
8
°
C
1
°
C
Figure 4. Copper Area vs. Power-MSOP
Power Dissipation (
T
JA
)
0
100
200
300
400
500
600
700
800
900
0
0.25 0.50 0.75 1.00 1.25 1.50
POWER DISSIPATION (W)
C
2
)
85
°
C
50
°
C 25
°
C
TJ = 125
°
C
Figure 5. Copper Area vs. Power-MSOP
Power Dissipation (T
A
)
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