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參數(shù)資料
| 型號(hào)： | MGA2805S |
| 廠商： | CRANE ELECTRONICS INC |
| 元件分類： | 基準(zhǔn)電壓源/電流源 |
| 英文描述： | DC/DC CONVERTERS 28 VOLT INPUT |
| 中文描述： | 1-OUTPUT 5 W DC-DC REG PWR SUPPLY MODULE |
| 文件頁數(shù)： | 7/8頁 |
| 文件大?。?/td> | 112K |
| 代理商： | MGA2805S |
B8-9
CASE D
C
ASES
0.060 (1.52)
0.075 (1.91)
0.030 (0.76)
0.100 (2.54) 4X
0.100 (2.54) 18X
1.000 (25.40)
1.000
(25.40)
CASE D
TOP VIEW
See Figure 13
for pin
configurations.
Materials
Header
Cover
Pins
Kovar/Nickel/Gold
Kovar/Nickel
Kovar/Nickel/Gold,
matched glass seal
Case dimensions in inches (mm)
Tolerance
±
0.005 (0.13) for three decimal places
±
0.01 (0.3) for two decimal places
unless otherwise specified
CAUTION
Maximum reflow temperature is 220
°
C for a
maximum of 30 seconds. SN60, SN62, or SN63
are the recommended types of solder. See below
for Solder Mask instructions.
1.110 max
(28.19)
1.110 max
(28.19)
Hand soldering should not exceed 300
°
C for 10
seconds per pin.
F
IGURE
12: C
ASE
D
M
AXIMUM
D
IMENSIONS
Cover marking is oriented with pin one
at the upper right corner.
Differently colored glass bead around pin one or dimple
in header (bottom or side of case) indicates pin one.
Straight Leads
(This view shows
straight leads.)
MGA Series: Screening – Standard, ES, or 883
0.010
(0.25)
0.135 ref.
(3.43)
Leads are solder dipped and lead
dimensions are prior to solder dip.
0.08
(2.0)
0.010 (0.25)
Bottom of lead to
bottom of case
0.055
(1.40)
0.070
(1.78)
1
1
TOP VIEW CASE D
1.400 ref. (35.56)
0.010
(0.25)
0.08
(2.0)
0.250 max.
(6.35)
0.50
(12.7)
2.115 ref. (53.72)
0.015
(0.38)
Seam seal
0.900 (22.86)
0.800 (20.32)
0.700 (17.78)
0.600 (15.24)
0.500 (12.70)
0.400 (10.16)
0.300 ( 7.62)
0.200 ( 5.08)
0.100 ( 2.54)
1.000 (25.40)
1
2
3
4
5
6
7
8
9
10
18
17
16
15
14
13
12
11
19
20
Gull Wing Leads
Option
Differently colored glass bead around pin one or dimple in
header (bottom or side of case) indicates pin one.
Cover marking is oriented with pin one at the upper right corner.
0.000
0
Solder Mask Notes
1. Pad dimensions are for the solder mask opening. Lead common to
each other can be connected underneath as desired.
2. Ground pins should be connected to the center pad for improved
grounding.
3. Center pad should not have a solder mask. Solder, copper, or Au/Ni
plate are preferred over solder for adhesive attach.
4. Solder coat to solder down converter.
5. If less rotation of case is desired, make the pad width 0.020inches
(0.51 mm). Pad length can be extended 0.010 inches (0.25 mm)
towards the case body and as-desired dimension away from the case
body.
6. Do not exceed 220°C as measured on the body of the converter (top
or bottom).
7. Attach the body of the case to the board with a thermally conductive
adhesive or SN60, 62, or 63 solder. The adhesive can be electrically
conductive as well. It can be applied as an underfill post solder or
dispensed and cured prior or during solder.
Note: Although every effort has been made to render the case drawings at actual size, variations in the printing process may cause some distortion. Please refer
to the numerical dimensions for accuracy.
F
IGURE
13: C
ASE
D
F
IGURE
14: C
ASE
D S
OLDER
M
ASK
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