參數(shù)資料
型號: MF1S7009DA4
廠商: NXP SEMICONDUCTORS
元件分類: 電源管理
英文描述: Mainstream contactless smart card IC for fast and easy solution development
中文描述: 1-CHANNEL POWER SUPPLY MANAGEMENT CKT, PXMA
封裝: PLASTIC, SOT-500-2
文件頁數(shù): 4/34頁
文件大?。?/td> 270K
代理商: MF1S7009DA4
MF1S7009
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2010. All rights reserved.
Product data sheet
PUBLIC
Rev. 3 — 26 July 2010
193031
4 of 34
NXP Semiconductors
MF1S7009
Mainstream contactless smart card IC
6. Pinning information
6.1 Smart card contactless module
Table 2.
Contactless interface module
Antenna contacts
LA
LB
7. Mechanical specification
Table 3.
Wafer
diameter
maximum diameter after foil expansion
thickness
flatness
Potential Good Dies per Wafer (PGDW)
Wafer backside
material
treatment
roughness
Fig 3.
Contact assignments for SOT500-2 (MOA4)
Bonding pad assignments to smart card contactless module
MF1S7009DA4
Symbol
Description
LA
Antenna coil connection LA
LB
Antenna coil connection LB
001aam200
top view
LA
LB
Specifications
200 mm typical (8 inches)
210 mm
120
μ
m
±
15
μ
m
not applicable
18482
Si
ground and stress relieve
R
a
max = 0.2
μ
m
R
t
max = 2
μ
m
Chip dimensions
step size
x = 1231
μ
m
y = 1280
μ
m
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