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參數(shù)資料
| 型號： | MF1PLUS6031DA4 |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 外設及接口 |
| 英文描述： | Mainstream contactless smart card IC for fast and easy solution development |
| 文件頁數(shù)： | 3/20頁 |
| 文件大?。?/td> | 154K |
| 代理商： | MF1PLUS6031DA4 |
MF1PLUSX0Y1_SDS
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product short data sheet
PUBLIC
Rev. 3.2 — 21 February 2011
163532
3 of 20
NXP Semiconductors
MF1PLUSx0y1
Mainstream contactless smart card IC
5. Ordering information
Table 2.
Type number
Ordering information
Package
Commercial
name
FFC
Name
Description
Version
MF1PLUS8001DUD/03
-
8 inch wafer (sawn; 120 μm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see
Ref. 3
,
4 kB EEPROM, 7-byte UID, L1 card
8 inch wafer (sawn; 120 μm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see
Ref. 3
,
4 kB EEPROM, 4-byte UID, L1 card
8 inch wafer (sawn; 120 μm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see
Ref. 3
,
4 kB EEPROM, 4-byte NUID, L1 card
plastic leadless module carrier package; 35 mm
wide tape, 4 kB EEPROM, 7-byte UID, L1 card
plastic leadless module carrier package; 35 mm
wide tape, 4 kB EEPROM, 4-byte UID, L1 card
plastic leadless module carrier package; 35 mm
wide tape, 4 kB EEPROM, 4-byte NUID, L1 card
-
MF1PLUS8011DUD/03
FFC
-
-
MF1PLUS8031DUD/03
FFC
-
-
MF1PLUS8001DA4/03
MOA4
PLLMC
SOT500-2
MF1PLUS8011DA4/03
MOA4
PLLMC
SOT500-2
MF1PLUS8031DA4/03
MOA4
PLLMC
SOT500-2
MF1PLUS6001DUD/03
FFC
-
8 inch wafer (sawn; 120 μm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see
Ref. 3
,
2 kB EEPROM, 7-byte UID, L1 card
8 inch wafer (sawn; 120 μm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see
Ref. 3
,
2 kB EEPROM, 4-byte UID, L1 card
8 inch wafer (sawn; 120 μm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see
Ref. 3
,
2 kB EEPROM, 4-byte NUID, L1 card
plastic leadless module carrier package; 35 mm
wide tape, 2 kB EEPROM, 7-byte UID, L1 card
plastic leadless module carrier package; 35 mm
wide tape, 2 kB EEPROM, 4-byte UID, L1 card
plastic leadless module carrier package; 35 mm
wide tape, 2 kB EEPROM, 4-byte NUID, L1 card
8 inch wafer (sawn; 120 μm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see
Ref. 3
,
4 kB EEPROM, 7-byte UID, no security level 1 or
2, L3 card
-
MF1PLUS6011DUD/03
FFC
-
-
MF1PLUS6031DUD/03
FFC
-
-
MF1PLUS6001DA4/03
MOA4
PLLMC
SOT500-2
MF1PLUS6011DA4/03
MOA4
PLLMC
SOT500-2
MF1PLUS6031DA4/03
MOA4
PLLMC
SOT500-2
MF1PLUS8001DUD/13
FFC
-
-
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PDF描述 |
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| MF1PLUS6031DUD | Mainstream contactless smart card IC for fast and easy solution development |
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| MF1PLUS8001DUD | Mainstream contactless smart card IC for fast and easy solution development |
| MF1PLUS8031DA4 | Mainstream contactless smart card IC for fast and easy solution development |
| MF1PLUS8031DUD | Mainstream contactless smart card IC for fast and easy solution development |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| MF1PLUS6031DA4/03, | 功能描述:RFID應答器 RFID MODULES DEV TOOLS RoHS:否 制造商:Murata 存儲容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體: 封裝:Reel |
| MF1PLUS6031DA403 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Mainstream contactless smart card IC for fast and easy solution development |
| MF1PLUS6031DUD/03, | 功能描述:RFID應答器 RFID MODULES & DEVELOPMENT TOOLS RoHS:否 制造商:Murata 存儲容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體: 封裝:Reel |
| MF1PLUS6031DUD03 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Mainstream contactless smart card IC for fast and easy solution development |
| MF1PLUS8001DA4/02 | 功能描述:IC SMART CARD 4KB EEPROM MOA4 RoHS:是 類別:RF/IF 和 RFID >> RFID IC 系列:MIFARE PLUS™ 其它有關文件:CR14 View All Specifications 標準包裝:1 系列:- RF 型:收發(fā)器 頻率:13.56MHz 特點:ISO14443-B 封裝/外殼:16-SOIC（0.154"，3.90mm 寬） 供應商設備封裝:16-SO 包裝:Digi-Reel® 其它名稱:497-5719-6 |
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