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參數(shù)資料
| 型號： | MF1ICS5005 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Standard Card IC Specification “bumped sawn wafer on UV-tape” |
| 中文描述： | 標準卡IC規(guī)范“撞鋸晶圓紫外線磁帶” |
| 文件頁數(shù)： | 2/7頁 |
| 文件大?。?/td> | 45K |
| 代理商： | MF1ICS5005 |
Philips Semiconductors
Product Specification Rev. 3.0 August 2004
Bumped sawn wafer on UV-tape
Standard Card IC MF1 IC S50 05
2
PUBLIC
CONTENTS
1
SCOPE.............................................................................................................................3
2
REFERENCE DOCUMENTS..............................................................................................3
2.1
Philips Documents.............................................................................................................3
3
MECHANICAL SPECIFICATION ........................................................................................3
3.1
Wafer................................................................................................................................3
3.2
Wafer Backside.................................................................................................................3
3.3
Chip Dimensions ...............................................................................................................3
3.4
Passivation........................................................................................................................3
3.5
Au Bump...........................................................................................................................3
4
ORDERING INFORMATION..............................................................................................3
4.1
Bumped die on sawn wafer................................................................................................3
5
CHIP ORIENTATION AND BONDPAD LOCATIONS ...........................................................4
6
ELECTRICAL SPECIFICATIONS .......................................................................................5
6.1
Absolute Maximum Ratings................................................................................................5
6.2
AC Characteristics.............................................................................................................5
7
DEFINITIONS ...................................................................................................................6
8
LIFE SUPPORT APPLICATIONS .......................................................................................6
9
REVISION HISTORY.........................................................................................................6
Contact Information........................................................................................................................7
MIFARE
is a registered trademark of Philips Electronics N.V.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MF1ICS5005V1D | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Standard Card IC Specification “bumped sawn wafer on UV-tape” |
| MF1ICS5005W/S7D,00 | 功能描述:射頻發(fā)射器 MF1ICS5005W/UNCASED/FOIL//S7D RoHS:否 制造商:Micrel 類型:ASK Transmitter 封裝 / 箱體:SOT-23-6 工作頻率:300 MHz to 450 MHz 封裝:Reel |
| MF1ICS5005W/V1D | 功能描述:射頻發(fā)射器 MIFARE 1K UV FFC BUMP RoHS:否 制造商:Micrel 類型:ASK Transmitter 封裝 / 箱體:SOT-23-6 工作頻率:300 MHz to 450 MHz 封裝:Reel |
| MF1ICS5005W/V1D,00 | 功能描述:射頻發(fā)射器 MIFARE 1K UV FFC RoHS:否 制造商:Micrel 類型:ASK Transmitter 封裝 / 箱體:SOT-23-6 工作頻率:300 MHz to 450 MHz 封裝:Reel |
| MF1ICS5005W/V9D | 功能描述:射頻發(fā)射器 MIFARE 1K UV FFC RoHS:否 制造商:Micrel 類型:ASK Transmitter 封裝 / 箱體:SOT-23-6 工作頻率:300 MHz to 450 MHz 封裝:Reel |
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