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Motorola Small–Signal Transistors, FETs and Diodes Device Data
Integrated Dual Inductive
Load Driver
Application circuit designs are moving toward the consolidation of
device count and into smaller packages. The new SOT–363 package is a
solution which simplifies circuit design, reduces device count, and
reduces board space by integrating a few discrete devices into one small
six–leaded package. The SOT–363 is ideal for low–power surface mount
applications where board space is at a premium, such as portable
products.
This device is intended to replace an array of four to eight discrete
components in an integrated SOT–363 package.
Optimized to Switch Inductive Pager/Phone Loads Such as Motors, Lamps
and Speakers from a 0.9 to 1.7 V Rail
LowVCE(sat) Performance
Internal Output Clamp Diodes
Provide a Robust Driver Interface between Inductive Load and Sensitive
Logic Circuits
Applications include:
Pager Silent Alert Motor
Pager E/M Acoustic Transducers
Ordering Information:
MDC3237T1: 8 mm, 7–inch/3,000 Unit Tape and Reel
MDC3237T3: 8 mm, 13–inch/10,000 Unit Tape and Reel
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Collector–Emitter Voltage
VCEO
15
Vdc
Collector–Base Voltage
VCBO
15
Vdc
Emitter–Base Voltage
VEBO
5.0
Vdc
Collector–Current
Continuous
IC
200
mAdc
Diode Reverse Voltage
VR
8.0
Vdc
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Total Device Dissipation
PD
150
mW
Thermal Resistance Junction to Ambient
RqJA
833
°C/W
Junction and Storage Temperature
TJ, Tstg
–55 to 150
°C
DEVICE MARKING
MDC3237T1 = E7
Order this document
by MDC3237T1/D
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
MDC3237T1
CASE 419B–01
SC–70/SOT–363
INTERNAL CIRCUIT DIAGRAM
Vin
(1)
GND
(5)
INTERNAL CIRCUIT DIAGRAM
6
5
4
3
1
2
Vout
(3)
Vin
(4)
Vout
(6)
VCC
(2)
6
5
4
1
2
3
Motorola, Inc. 1998
REV 1