參數(shù)資料
型號: MDC3105
廠商: ON SEMICONDUCTOR
英文描述: Integrated Relay, Inductive Load Driver(電感負(fù)載/延遲驅(qū)動器)
中文描述: 綜合繼電器,感性負(fù)載驅(qū)動器(電感負(fù)載/延遲驅(qū)動器)
文件頁數(shù): 11/12頁
文件大?。?/td> 118K
代理商: MDC3105
MDC3105
http://onsemi.com
11
PACKAGE DIMENSIONS
SOT23 (TO236)
CASE 31808
ISSUE AN
D
A1
3
1
2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. 31801 THRU 07 AND 09 OBSOLETE, NEW
STANDARD 31808.
mm
inches
SCALE 10:1
0.8
0.031
0.9
0.035
0.95
0.037
0.95
0.037
2.0
0.079
SOLDERING FOOTPRINT*
VIEW C
L
0.25
L1
e
E
E
b
A
SEE VIEW C
DIM
A
A1
b
c
D
E
e
L
L1
H
E
MIN
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.10
0.35
NOM
1.00
0.06
0.44
0.13
2.90
1.30
1.90
0.20
0.54
MAX
1.11
0.10
0.50
0.18
3.04
1.40
2.04
0.30
0.69
MIN
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.004
0.014
MILLIMETERS
INCHES
NOM
0.040
0.002
0.018
0.005
0.114
0.051
0.075
0.008
0.021
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
MAX
H
STYLE 6:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
2.10
2.40
2.64
0.083
0.094
0.104
c
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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