
DiskOnChip 2000 DIP
91-SR-002-42-8L Rev.
3.4
13
7
Specifications
7.1 Absolute Maximum Ratings
Parameter
Symbol
DC supply
voltage
3.3V Model Rating
1
-0.5 to 4.6
5V Model Rating
1
-0.3 to 6.0
Units
V
Notes
V
CCS
Input pin
voltage
Input pin
current
V
IN
-0.5 to V
CC
+ 0.3
-0.3 to V
CC
+ 0.3
V
I
IN
Not Specified
-10 to 10
mA
+25 °C
Note 1
:
Permanent device damage may occur if absolute maximum ratings are exceeded. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
Note 2
:
The voltage on any pin may undershoot to -2.0V or overshoot to Vcc+2.0V for periods <20ns.
7.2 Capacitance
Symbol
C
I/O
Parameter
Input/Output
Capacitance
Conditions
MD2200/2, V
IN
= 0V
MD2203, V
IN
= 0V
3.3V Model Rating
12
36
5V Model Rating
15
45
Unit
pF
pF
Note
: Capacitance is not 100% tested.
7.3 Temperature Ranges
Commercial operating temperature:
0 oC to +70 oC*
Extended operating temperature:
-40 oC to +85 oC
Storage temperature:
-50 oC to +85 oC
*
DiskOnChip 2000 192MB and 576MB capacities are available only for commercial temperature ranges.
7.4 DiskOnChip Assembly
The DiskOnChip 2000 DIP device is not hermetically sealed. Therefore, it must be assembled after
the PCB goes through its final rinse. Assembling DiskOnChip 2000 prior to the rinse phase may
cause it to absorb moisture. Failure to adhere to the above assembly instruction can lead to device
failures not covered by M-Systems' warranty.
Note
: DiskOnChip 2000 DIP requires a DIP socket on the target platform. Due to its plastic shell and molding material, it
cannot be soldered directly to the platform.
7.5 Humidity
10% - 90% relative, non-condensing