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參數(shù)資料
| 型號： | MCZ33996EK |
| 廠商： | 飛思卡爾半導(dǎo)體(中國)有限公司 |
| 英文描述： | 16-Output Switch with SPI Control |
| 中文描述： | 16輸出帶有SPI控制開關(guān) |
| 文件頁數(shù)： | 19/23頁 |
| 文件大?。?/td> | 306K |
| 代理商： | MCZ33996EK |
Analog Integrated Circuit Device Data
Freescale Semiconductor
19
33996
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Introduction
This thermal addendum is provided as a supplement to the MC33996 technical
datasheet. The addendum provides thermal performance information that may be
critical in the design and development of system applications. All electrical,
application, and packaging information is provided in the datasheet.
Packaging and Thermal Considerations
The MC33996 is offered in a 32 pin SOICW exposed pad, single die package.
There is a single heat source (P), a single junction temperature (T
J
), and thermal
resistance (R
θ
JA
).
The stated values are solely for a thermal performance comparison of one
package to another in a standardized environment. This methodology is not meant
to and will not predict the performance of a package in an application-specific
environment. Stated values were obtained by measurement and simulation
according to the standards listed below.
Standards
Figure 14. Surface Mount for SOICW Exposed Pad
32-PIN
SOICW-EP
33996EK
EK (PB-FREE) SUFFIX
98ARL10543D
32-PIN SOICW-EP
Note
For package dimensions, refer to
the 33996 data sheet.
T
J
=
R
θ
JA
.
P
Table 7. Thermal Performance Comparisons
Thermal Resistance
[
°
C/W]
R
θ
JA
(1)
,
(2)
29
R
θ
JB
(2)
,
(3)
9.0
R
θ
JA
(1)
,
(4)
69
R
θ
JC
(5)
2.0
Notes:
1.
Per JEDEC JESD51-2 at natural convection, still air
condition.
2s2p thermal test board per JEDEC JESD51-5 and
JESD51-7.
Per JEDEC JESD51-8, with the board temperature on the
center trace near the center lead.
Single layer thermal test board per JEDEC JESD51-3 and
JESD51-5.
Thermal resistance between the die junction and the
exposed pad surface; cold plate attached to the package
bottom side, remaining surfaces insulated.
2.
3.
4.
5.
1.0
1.0
0.2
0.2
*All Measurements
are in Millimeters
32 Pin SOICW-EP
0.65 Pitch
11.0 mm x 7.5mm Body
4.6 mm x 5.7 mm Exposed Pad
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MCZ33996EK | 制造商:Freescale Semiconductor 功能描述:IC LOAD SWITCH 27V 32SOIC |
| MCZ33996EKR2 | 功能描述:開關(guān)變換器、穩(wěn)壓器與控制器 16 LOW SIDE SW 1.20HM RoHS:否 制造商:Texas Instruments 輸出電壓:1.2 V to 10 V 輸出電流:300 mA 輸出功率: 輸入電壓:3 V to 17 V 開關(guān)頻率:1 MHz 工作溫度范圍: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WSON-8 封裝:Reel |
| MCZ33998EG | 功能描述:開關(guān)變換器、穩(wěn)壓器與控制器 2.6/5.0V SWITCHING POWER RoHS:否 制造商:Texas Instruments 輸出電壓:1.2 V to 10 V 輸出電流:300 mA 輸出功率: 輸入電壓:3 V to 17 V 開關(guān)頻率:1 MHz 工作溫度范圍: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WSON-8 封裝:Reel |
| MCZ33998EG/R2 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Switching Power Supply with Linear Regulators |
| MCZ33998EGR2 | 功能描述:開關(guān)變換器、穩(wěn)壓器與控制器 2.6/5.0V SWITCHING POWER RoHS:否 制造商:Texas Instruments 輸出電壓:1.2 V to 10 V 輸出電流:300 mA 輸出功率: 輸入電壓:3 V to 17 V 開關(guān)頻率:1 MHz 工作溫度范圍: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WSON-8 封裝:Reel |
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